Next-Gen SerDes Roadmap

By Ed Sperling - 25 May, 2021 - Comments: 0

An explosion in data is causing a series of successive bottlenecks in the data center. Priyank Shukla, product marketing manager for high-speed SerDes IP at Synopsys, digs into the performance roadmap for moving data within server racks and between different racks, where the bottlenecks are today, and how they will be addressed in the future. Related SerDes Knowledge Center Top stories... » read more

Network Interface Card Evolution

By Ed Sperling - 31 Mar, 2021 - Comments: 0

Longer chip lifetimes, more data to process and move, and a slowdown in the rate of processor improvements has created a series of constantly shifting bottlenecks. Kartik Srinivasan, director of data center marketing at Xilinx, looks at one of those bottlenecks, the network interface card, why continuous enhancements and changes will be required, and how to extend the life of NICs as the networ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 28 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Marvell is working on silicon for the data infrastructure market using TSMC’s 5nm process node. Marvell says it has multiple designs already under contract for its 5nm portfolio across the carrier, enterprise, automotive, and data center markets. The first products are sampling by the end of next year. Ansys’ multiphysics signoff tools, R... » read more

Smart NiCs

By Ed Sperling - 05 Aug, 2019 - Comments: 1

Manish Sinha, strategic planning for marketing and business at Achronix, talks with Semiconductor Engineering about what’s changing in networking interface cards, how to get more performance out of these devices, and how much needs to be in hardware versus software. » read more

Ethernet NIC For Fast Data Path

By Nishant Lodha - 06 Jun, 2019 - Comments: 0

A bit of validation once in a while is good for all of us – that’s pretty true whether you are the one providing it or, conversely, the one receiving it. Most of the time it seems to be me that is giving out validation rather than getting it. Like the other day when my wife tried on a new dress and asked me, “How do I look?” Now, of course, we all know there is only one way to answer a ... » read more

Applications And Low Power

By Ed Sperling - 12 May, 2011 - Comments: 0

By Pallab Chatterjee As new process technologies are being developed to make devices smaller, they are also driving the operating power lower for the devices and systems. The goal is to reduce the power requirements for the system and hence increase the functional life on a single battery charge. This concept has worked in the semiconductor industry from 10-micron processes down to the 6... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer