Manish Sinha, strategic planning for marketing and business at Achronix, talks with Semiconductor Engineering about what’s changing in networking interface cards, how to get more performance out of these devices, and how much needs to be in hardware versus software.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Tools become more specific for Si/SiGe stacks, 3D NAND, and bonded wafer pairs.
Thinner photoresist layers, line roughness, and stochastic defects add new problems for the angstrom generation of chips.
Key pivot and innovation points in semiconductor manufacturing.
The verification of a processor is a lot more complex than a comparably-sized ASIC, and RISC-V processors take this to another layer of complexity.
Less precision equals lower power, but standards are required to make this work.
Open-source processor cores are beginning to show up in heterogeneous SoCs and packages.
New applications require a deep understanding of the tradeoffs for different types of DRAM.
Open source by itself doesn’t guarantee security. It still comes down to the fundamentals of design.
How customization, complexity, and geopolitical tensions are upending the global status quo.
127 startups raise $2.6B; data center connectivity, quantum computing, and batteries draw big funding.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Ensuring that your product contains the best RISC-V processor core is not an easy decision, and current tools are not up to the task.
Very well explained by Manish. Good to hear about the new changes which are taking place.