Expand Your Semiconductor’s Market With Programmable Data Planes

By Jayson Bethurem - 01 Feb, 2024 - Comments: 1

In nearly every communication interface today, many challenges exist. Not only must networks manage high volumes of data traffic, they must also be highly aware of malicious data intrusions. With increasing data moving though these networks, combined with demand for faster response times and lower latency, high performance packet processors came into existence as these were the only mechanisms ... » read more

Increasing AI Energy Efficiency With Compute In Memory

By Katherine Derbyshire - 16 Nov, 2023 - Comments: 0

Skyrocketing AI compute workloads and fixed power budgets are forcing chip and system architects to take a much harder look at compute in memory (CIM), which until recently was considered little more than a science project. CIM solves two problems. First, it takes more energy to move data back and forth between memory and processor than to actually process it. And second, there is so much da... » read more

Efficient Data Transfer With High-Speed Serial Flash Interface IP

By Synopsys - 06 Apr, 2022 - Comments: 0

Technology advancement and increasing data transfer rate, have made serial flash memories widely popular to store data on off-chip locations. Traditionally, flash memory devices use a primary controller to interface with the CPU and get the data from the memory device. For large amounts of data, the communication with the CPU is mostly performed by the external Direct Memory Access (DMA) contro... » read more

Power/Performance Bits: April 13

By Jesse Allen - 13 Apr, 2021 - Comments: 0

Speedy data transfer Researchers from MIT, Intel, and Raytheon developed a new data transfer system that both boosts speeds and reduces energy use by taking elements from both traditional copper cables and fiber optics. "There's an explosion in the amount of information being shared between computer chips -- cloud computing, the internet, big data. And a lot of this happens over conventiona... » read more

Smart NiCs

By Ed Sperling - 05 Aug, 2019 - Comments: 1

Manish Sinha, strategic planning for marketing and business at Achronix, talks with Semiconductor Engineering about what’s changing in networking interface cards, how to get more performance out of these devices, and how much needs to be in hardware versus software. » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.