AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric


Recent industry trends, including the release of NVIDIA’s Rubin platform (developer.nvidia.com), point to a growing consensus that AI inference is reshaping data center architecture in a fundamental way. As inference workloads become dominant, the data center network is no longer just a communication layer between servers. It is increasingly part of a distributed memory and storage hierarchy,... » read more

New Automotive Architectures Are Shaking Up Processor And Memory Choices


Key Takeaways Assisted and autonomous driving require more data from more sensors, and much faster processing of some of that data. The shift to software-defined vehicles and centralized intelligence makes it easier to identify where the most advanced processors and memories are required, and where older and less expensive technologies can be deployed. Technologies that were largely ... » read more

A Decade Of Architectural RowHammer Defense Solutions (Meta, SNU, UIUC)


A new technical paper titled "SoK: Systematizing a Decade of Architectural RowHammer Defenses Through the Lens of Streaming Algorithms" was published by researchers at Meta, Seoul National University and University of Illinois at Urbana-Champaign. Abstract: "A decade after its academic introduction, RowHammer (RH) remains a moving target that continues to challenge both the industry and aca... » read more

Is There Still a Future for Hard Disk Drives?


The capacity for solid state drives (SSDs) keeps going up while the price per terabyte keeps falling, sometimes raising questions about the future for hard disk drives (HDDs). Will the cost of SSDs per TB eventually become so low that they will totally displace HDDs? I decided to ask a couple of experts in the field, Jim Handy from Objective Analysis and Tom Coughlin of Coughlin Associates. ... » read more

Research Bits: Feb. 25


Recording synaptic connections Researchers from Harvard University built a silicon chip capable of recording synaptic signals from a large number of neurons and used it to catalogue more than 70,000 synaptic connections from about 2,000 rat neurons. They hope the device is a step in creating a detailed synaptic connection map of the brain. The chip contains an array of 4,096 microhole elect... » read more

Harnessing Computational Storage For Faster Data Processing


By Ujjwal Negi and Prashant Dixit In the evolving landscape of data storage, computational storage devices (CSDs) are revolutionizing how we process and store data. By embedding processing capabilities within storage units, these devices enable in-situ data manipulation, minimizing data movement between storage and CPUs and dramatically improving performance and efficiency. This paradigm shi... » read more

Ferroelectric Memories Answer Call For Non-Volatile Alternatives


As system designers seek to manipulate larger data sets while reducing power consumption, ferroelectric memory may be part of the solution. It offers an intermediate step between the speed of DRAM and the stability of flash memory. Changing the polarization of ferroelectric domains is extremely fast, and the polarization remains stable without power for years, if not decades. FeFETs, one of ... » read more

Breaking The 1M RAID5 Write IOPS Barrier


In today’s data-centric age, enormous amounts of data are generated, stored and processed at an unprecedented rate. Businesses are utilizing this data to make better decisions, drive greater efficiencies, develop more desirable products, improve profitability and ultimately increase user satisfaction. To continue deriving a high degree of value from a rapidly-expanding data flow, today’s en... » read more

Research Bits: Oct. 18


Modular AI chip Engineers at the Massachusetts Institute of Technology (MIT), Harvard University, Stanford University, Lawrence Berkeley National Laboratory, Korea Institute of Science and Technology, and Tsinghua University created a modular approach to building stackable, reconfigurable AI chips. The design comprises alternating layers of sensing and processing elements, along with LEDs t... » read more

Is There A Limit To The Number of Layers In 3D-NAND?


Memory vendors are racing to add more layers to 3D NAND, a competitive market driven by the explosion in data and the need for higher-capacity solid state drives and faster access time. Micron already is filling orders for 232-layer NAND, and not to be outdone, SK Hynix announced that it will begin volume manufacturing 238-layer 512Gb triple level cell (TLC) 4D NAND in the first half of next... » read more

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