Manufacturing Bits: March 20

By Mark LaPedus - 20 Mar, 2018 - Comments: 0

Giant thermometer The Department of Energy's Oak Ridge National Laboratory has devised a new way to take the temperature of a material at the nanoscale—the organization has developed a giant thermometer. The technology, dubbed electron energy gain spectroscopy, enables researchers to take the temperature of a material from an area at about a billionth of a meter wide. Developed by Nion, t... » read more

Manufacturing Bits: Sept. 22

By Mark LaPedus - 22 Sep, 2015 - Comments: 0

Superconductor puddles Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures near zero to work, which, in turn, limits their applications. High-temperature superconductors are more promising technologies, but once again, they must be cooled down to function. The industr... » read more

Manufacturing Bits: April 8

By Mark LaPedus - 08 Apr, 2014 - Comments: 0

Making cheap diamonds Graphite and diamonds are two forms of the same element--carbon. In graphite, carbon atoms are arranged in planar sheets and the material is soft. On the other hand, diamonds consist of carbon atoms that are bonded in all directions, making these structures extremely hard. [caption id="attachment_11311" align="alignleft" width="150"] This illustration shows four layers... » read more

Manufacturing Bits: Dec. 3

By Mark LaPedus - 03 Dec, 2013 - Comments: 0

Animal robots invade London The London Science Museum will premiere U-CAT, an underwater robot turtle designed to penetrate shipwrecks. In the exhibit, the museum will also showcase several robots that resemble an eel, bat, cheetah cub, tumbleweed, tuna, salamander and other creatures. Meanwhile, built by the Centre for Biorobotics at Tallinn University of Technology, U-CAT’s locomotio... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NIMS

Manufacturing Bits: March 20

Manufacturing Bits: Sept. 22

Manufacturing Bits: April 8

Manufacturing Bits: Dec. 3