The Week in Review: IoT

By Jeff Dorsch - 27 Apr, 2018 - Comments: 0

Cybersecurity Cybersecurity concerns continued to generate news this week. Symantec reported a corporate espionage hacking campaign against manufacturers of medical supplies, dubbing the efforts “Orangeworm.” The hackers have attacked 24 or more targets this year, and almost 100 since 2015, according to the security software and services firm. Meanwhile, the House Energy and Commerce Co... » read more

New Wii U™ on SOI

By Various Writers - 08 Jul, 2011 - Comments: 0

By Adele Hars If you've followed the industry buzz in recent weeks, you've seen the news: the CPU for Nintendo's upcoming (and very cool) Wii U is on IBM's 45nm SOI. IBM's been fabbing chips for Nintendo for over a decade, and first moved the company's CPUs to SOI in 2006, at 90nm. The Wii U, which got its debut at the recent E3 show, will hit the shelves in 2012. The Wii U combines m... » read more

Mobile Gaming: The Next Power-Saving Frontier

By Ed Sperling - 08 Jul, 2010 - Comments: 0

By Pallab Chatterjee Mobile and handheld gaming platforms are gaining lots of attention these days, and from a low-power engineering standpoint it poses a challenge that dwarfs any game played on the devices. Unlike mobile phones, these handheld platforms don’t have the luxury of trading off between multiple operating modes to extend battery life. Even worse, they have to perform at the ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Nintendo

The Week in Review: IoT

New Wii U™ on SOI

Mobile Gaming: The Next Power-Saving Frontier