tag: NIST

Blog Review: Aug. 5
By Jesse Allen - 05 Aug, 2015 - Comments: 0

Fresh from the July 2015 Type-C InterOp Event, where USB engineers wheel a prototype on a cart from hotel room to hotel room, testing interoperability, Synopsys' Morten Christiansen says Type-C has arrived. Mentor's Colin Walls discusses the reasons to tackle embedded software development with a bottom-up approach. In their latest video, Cadence's Kishore Kasamsetty discusses why choose L... » read more

Manufacturing Bits: July 21
By Mark LaPedus - 21 Jul, 2015 - Comments: 0

Graphene metrology Harvard University, Monash University and the U.S. Department of Energy’s Lawrence Berkeley National Laboratory have developed a new technique that provides atomic-scale images of colloidal nanoparticles. The technique, dubbed SINGLE, stands for 3D Structure Identification of Nanoparticles by Graphene Liquid Cell Electron Microscopy. Using the technology, researchers ha... » read more

Manufacturing Bits: July 7
By Mark LaPedus - 07 Jul, 2015 - Comments: 0

Silicon photonics prototyping A group of European and other research organizations have put the finishing touches on a project to help propel the development of silicon photonics into the commercial market. The project, dubbed ESSenTIAL, enables small- to mid-sized enterprises to develop prototypes and products based on silicon photonics. Funded by the European Commission, the project inclu... » read more

Biometrics For The IoT
By Ernest Worthman - 04 Jun, 2015 - Comments: 0

In part one of this topic we started at the top with an overview of biometrics and its base technology. Now, let’s ratchet that up a notch and drill down a bit into some of the details. While biometrics has a lot of potential tools, presently there are only two that are in wide-scale deployment—fingerprint and facial scanning. “Of those two, fingerprints account for 60% to 70% of all a... » read more

Manufacturing Bits: June 2
By Mark LaPedus - 02 Jun, 2015 - Comments: 0

X-raying chocolate X-ray scattering is a next-generation metrology technology. Using an X-ray source, the technology can be used for imaging complex structures and films in three dimensions. It can be used in various applications, such as biology and semiconductors. Here’s another surprising application: chocolate. Using X-ray scattering, Deutsches Elektronen-Synchrotron (DESY) has helped... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 May, 2015 - Comments: 0

At an event, Samsung rolled out its 10nm finFET technology. The company also showed a 300mm wafer with 10nm finFET transistors. "We have silicon-based PDKs out," said Kelvin Low, senior director of foundry marketing for Samsung. Samsung plans to move into production with its 10nm finFET technology by the end of 2016, he said. IC Insights released its chip rankings in terms of sales in the fi... » read more

Waiting For Next-Gen Metrology
By Mark LaPedus - 21 May, 2015 - Comments: 0

Chipmakers continue to march down the various process nodes, but the industry will require new breakthroughs to extend IC scaling at 10nm and beyond. In fact, the industry will require innovations in at least two main areas—patterning and the [getkc id="36" comment="Interconnect"]. There are other areas of concern, but one technology is quickly rising near the top of the list—metrology.... » read more

Manufacturing Bits: May 12
By Mark LaPedus - 12 May, 2015 - Comments: 0

Photonic thermometers The National Institute of Standards and Technology (NIST) has developed a new class of photonic thermometers. These chip-based thermometers measure temperature using light. They are resistant to electromagnetic interference and are self-calibrating. In the future, photonic thermometers could be buried into walls or sent into space. They could be used for chemical, pres... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

Manufacturing Bits: March 24
By Mark LaPedus - 24 Mar, 2015 - Comments: 0

Mouse brains to multi-beam At the recent SPIE Advanced Lithography conference, Sematech provided an update on its multi-beam, e-beam inspection program. The goal is to develop a next-generation inspection tool, which could be faster than traditional e-beam inspection and could one day displace brightfield inspection. “Optical inspection is having trouble detecting particles that are small... » read more

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