tag: Nordson

Defect Challenges Grow At The Wafer Edge
By Laura Peters - 10 Sep, 2024 - Comments: 0

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly repercussions that span multiple processes and multi-chip packages. This is made more difficult by the widespread rollout of such processes as hybrid bonding, which require pristine surfaces, and the gro... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Chip Industry Week in Review
By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Micro Dispensing: From Semiconductors To Sushi
By Muge Deniz Meiller - 11 Jun, 2024 - Comments: 0

The phrase “micro fluid dispensing” is generally associated with applications like medical device assembly or battery manufacturing. It certainly doesn’t conjure up visions of sushi – at least not yet. If engineers at IHI Aerospace and Yamagata University have their way, though, 3D printed sushi will be served to space tourists as they circle in low Earth orbit. Yes, printed sush... » read more

Return On Investment Of A Pre-Reflow AOI System
By Nordson Test And Inspection - 14 May, 2024 - Comments: 0

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate ... » read more

Progress In Wafer And Package Level Defect Inspection
By Anne Meixner - 09 Apr, 2024 - Comments: 0

The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex manufacturing processes. In both wafer and assembly manufacturing, engineering teams have long relied on imaging tools to measure critical features and to inspect for defects after specific pr... » read more

X-ray Inspection In The Semiconductor Industry
By Chris Rand - 12 Mar, 2024 - Comments: 0

With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures and electrical connections in the production of chips have become smaller and smaller. In addition, the sheer number of these connections in a given unit area have also increased in a spectacular way. At the heart of all X-ray inspection, whether it is manual or fully automated metrolog... » read more

Top Tech Videos of 2023
By Liz Allan - 29 Dec, 2023 - Comments: 0

In 2023, heterogeneous integration, RISC-V, and advanced node logic scaling and advanced packaging dominated the semiconductor industry. All of those topics spurred deep discussions at conferences, and they were the subject of Semiconductor Engineering's most popular videos. Of the videos published in 2023, here are the highlights from our five channels: Manufacturing, Packaging & Mater... » read more

Fluid Dispensing For Packaging Today’s Devices
By Nordson Test And Inspection - 12 Dec, 2023 - Comments: 0

Fluid dispensing systems are evolving in order to address the challenges that system-in-package (SiP) and micromechanical systems (MEMS) packages face, especially in regard to tight geometries and assembly processes. These packages, used in smartphones, have become more miniaturized, and as a result, have created added value in the market. However, they include a variety of small dies or dev... » read more

X-ray And Acoustic Inspection
By Nordson Test And Inspection - 07 Nov, 2023 - Comments: 0

X-ray and acoustic imaging are two very complimentary tools for non destructively inspecting the quality of electronics components. Both techniques give information on different aspects of component integrity. Click here to read more of this application note from Nordson's Test and Inspection division.   » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy