tag: Nordson Test & Inspection

Progress In Wafer And Package Level Defect Inspection
By Anne Meixner - 09 Apr, 2024 - Comments: 0

The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex manufacturing processes. In both wafer and assembly manufacturing, engineering teams have long relied on imaging tools to measure critical features and to inspect for defects after specific pr... » read more

Deep Learning For Corner Fill Inspection
By Nordson Test And Inspection - 08 Feb, 2024 - Comments: 0

When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. But there are some challenging applications. Some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. Given an image containing a cat, a dog and a d... » read more

Glass Substrates Gain Foothold In Advanced Packages
By Gregory Haley - 09 Jan, 2024 - Comments: 2

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

Rebalancing Test And Yield In IC Manufacturing
By Gregory Haley - 07 Nov, 2023 - Comments: 0

Balancing yield and test is essential to semiconductor manufacturing, but it's becoming harder to determine how much weight to give one versus the other as chips become more specialized for different applications. Yield focuses on maximizing the number of functional chips from a production batch, while test aims to ensure that each chip meets rigorous quality and performance standards. And w... » read more

Wirebonding Is Here To Stay
By Gregory Haley - 19 Oct, 2023 - Comments: 0

Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the beginning of the electronics industry. Like everything else in the semiconductor market, wirebonding technologies have changed over ... » read more

Fab And Field Data Transforming Manufacturing Processes
By Gregory Haley - 12 Sep, 2023 - Comments: 0

The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product's performance in real-time and under real-world conditions and use cases. Historically, data that encapsulates parameters such as power consumption, temperature, voltages, currents, timing, and other characteristics, was confined to d... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 01 Sep, 2023 - Comments: 0

Bosch completed its acquisition of TSI Semiconductors to expand its SiC chips business, reports Reuters. In April, Bosch announced plans to invest $1.5 billion in the Roseville, California, foundry to convert TSI’s manufacturing facilities into state-of-the-art processes, with the first SiC chips due out in 2026. Bosch CEO Stefan Hartung said the full expansion "depends on the support of the... » read more

Manual X-ray Inspection
By Ed Sperling - 28 Aug, 2023 - Comments: 0

Increased density in advanced node chips and advanced packaging offers a way to greatly improve performance and reduce power, but it also makes it harder to inspect these devices for real and latent defects. Higher density can lead to scattering of light, and heterogeneous integration in a package means it’s not always possible to see through all materials equally. Chris Rand, product line ma... » read more

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