Manufacturing Bits: March 6

By Mark LaPedus - 06 Mar, 2018 - Comments: 0

Security ICs with multi-beam Leti, a research institute of CEA Tech, and Mapper Lithography have developed a new application for its multi-beam, direct-write lithography technology—security. In 2016, Mapper Lithography introduced the FLX-1200, a direct-write, multi-beam e-beam system. Using a 5-kV acceleration voltage, a beam generator creates an electron beam about 3cm in diameter. Then,... » read more

Power/Performance Bits: Jan. 9

By Jesse Allen - 09 Jan, 2018 - Comments: 0

Eel-inspired power Researchers at the University of Michigan, the University of Fribourg, and the University of California-San Diego developed soft power cells with the potential to power implanted medical devices. Made of hydrogel and salt, the soft cells form the first potentially biocompatible artificial electric organ that generates more than 100 volts at a low current, the team says, enou... » read more

Power/Performance Bits: Sept. 26

By Jesse Allen - 26 Sep, 2017 - Comments: 0

Long-range communication Researchers at the University of Washington developed devices that run on almost zero power can transmit data across distances of up to 2.8 kilometers. The long-range backscatter system, which uses reflected radio signals to transmit data at extremely low power, achieved reliable coverage throughout 4800-square-foot house, an office area covering 41 rooms and a one-acr... » read more

DARPA CHIPS Program Pushes For Chiplets

By Ann Mutschler - 14 Sep, 2017 - Comments: 0

While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

Power/Performance Bits: May 16

By Jesse Allen - 16 May, 2017 - Comments: 0

Chaos-based IC Researchers at North Carolina State University and the College of Wooster developed a three transistor nonlinear, chaos-based integrated circuit combining digital and analog components, which they hope can improve computational power by enabling processing of a larger number of inputs. In chaos-based, nonlinear circuits, one circuit can perform multiple computations instead... » read more

Manufacturing Bits: Oct. 25

By Mark LaPedus - 25 Oct, 2016 - Comments: 0

GaN-on-GaN power semis Power semiconductors based on gallium nitride (GaN) are heating up in the market. Typically, suppliers are shipping devices using a GaN-on-silicon process. These devices are available with blocking voltages of up to 650 volts. Going beyond 650 volts is problematic, however. GaN-on-silicon processes suffer from lattice mismatches, cost and other issues. At the ... » read more

Power/Performance Bits: Sept. 13

By Jesse Allen - 13 Sep, 2016 - Comments: 0

Core-to-core communication Most research featured in the Power/Performance Bits has far-off applications, but a team from North Carolina State University and Intel developed something that could be brought into practice today: a way to accelerate core-to-core communication. Many important workloads incur significant core-to-core communication and are affected significantly by the costs, i... » read more

What’s Missing From Machine Learning

By Ed Sperling - 01 Sep, 2016 - Comments: 1

Machine learning is everywhere. It's being used to optimize complex chips, balance power and performance inside of data centers, program robots, and to keep expensive electronics updated and operating. What's less obvious, though, is there are no commercially available tools to validate, verify and debug these systems once machines evolve beyond the final specification. The expectation is th... » read more

Manufacturing Bits: Aug. 23

By Ed Sperling - 23 Aug, 2016 - Comments: 0

Rolling Out Solar Power...Literally An International team of researchers have developed solar cells that can be added onto a roll of flexible plastic in liquid form, bringing the same kind of economies of production to the solar industry as rolls of paper and ink did for newspapers more than a century ago. Using a roll-to-roll processing method, the team was able to achieve a power conversi... » read more

Manufacturing Bits: July 26

By Mark LaPedus - 26 Jul, 2016 - Comments: 0

Jumping films Riken and the University of Tokyo have developed a tiny autonomous actuator. The actuator, which is based on a special material, can automatically curl up or straighten out when exposed to ambient humidity. And in certain conditions, the film can even jump into the air by itself. A video can be seen here. Researchers placed a material called guanidinium carbonate into a hig... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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