tag: Nvidia

The Week In Review: Manufacturing
By Mark LaPedus - 20 May, 2016 - Comments: 0

Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 May, 2016 - Comments: 0

Chipmakers Samsung has rolled out the Samsung Family Hub Refrigerator, an appliance that changes the landscape in the refrigerator market. The refrigerator comes with a 21.5-inch LCD touchscreen, which serves as the digital command center and connects to a smartphone. It enables consumers to view inside the fridge with a smartphone while grocery shopping. It can access music or television cont... » read more

Prototype Like A Pro
By Tom De Schutter - 24 Mar, 2016 - Comments: 0

FPGA-based prototyping has been a key prototyping technique for many years. The steady increase in software content and thus the need to verify and validate the SoC in context of the software has resulted in an equally steady increase in its usage. FPGA-based prototyping or physical prototyping, as it is also called, offers a great way to develop software, verify the hardware in context of that... » read more

The Big Shift
By Ed Sperling - 18 Feb, 2016 - Comments: 0

The number of chipmakers that truly can differentiate their products by moving to the next process node is falling, and that pool will continue to shrink even further over the next few years. Processor companies such as Intel and IBM always will benefit from scaling and architectural changes. So will GPU companies such as Nvidia, and FPGA vendors such as Xilinx, Microsemi and Altera (now par... » read more

Inside Advanced Packaging
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

Inside AI And Deep Learning
By Mark LaPedus - 21 Jan, 2016 - Comments: 0

Semiconductor Engineering sat down to talk with Dave Schubmehl, research director for content analytics, discovery and cognitive systems at International Data Corp. (IDC), a market research firm. Schubmehl’s research covers information access, artificial intelligence, cognitive computing, deep learning, machine learning and other topics. He also addressed neuromorphic technology. What follows... » read more

Manufacturing Bits: Nov. 17
By Mark LaPedus - 17 Nov, 2015 - Comments: 0

Speedy nano-scale subs For years, researchers have been developing nano-scale submarines. In theory, nano-subs could be used in various applications. For example, they could navigate inside the human body and transport medicine to various organs. The problem? Most nano-subs use or generate toxic chemicals, according to researchers from Rice University. Seeking to solve the problem, Rice ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Oct, 2015 - Comments: 0

Looking to propel the next wave of OLED displays, Applied Materials has rolled out two new systems. The tools enable the volume production of OLED displays for both mobile products and TVs. In addition, Applied Materials has shipped an Applied TopMet roll-to-roll metal deposition system to Jindal Poly Films, a leader in PET and BOPP films for flexible packaging and labeling applications. In... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Aug, 2015 - Comments: 0

IC Insights released its top-20 chip rankings in terms of sales for the first half of 2015. Samsung’s growth rate in 2Q ‘15 put the company closer to catching Intel, the world’s largest chipmaker. IC Insights also showed how the top-20 rankings would have looked if the proposed Avago/Broadcom and NXP/Freescale mergers were in place. Avago/Broadcom would have been ranked 7th and NXP/Freesc... » read more

Top 15 Integrating Points In The Continuum Of Verification Engines
By Frank Schirrmeister - 30 Jul, 2015 - Comments: 0

The integration game between the different verification engines, dynamic and static, is in full swing. Jim Hogan talked about the dynamic engines that he dubbed “COVE”, and I recently pointed out a very specific adoption of COVE in my review of some customer examples at DAC 2015 in “Use Model Versatility Is Key for Emulation Returns on Investment”. Here are my top 15 integrating poin... » read more

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