Making Flexible OLED Displays

By Mark LaPedus - 12 Oct, 2015 - Comments: 0

Organic light-emitting diodes (OLEDs) are supposedly the next big thing in display technology. In fact, over the years, several display makers have spent billions of dollars to build new and large OLED fabs. To be sure, OLEDs enable brighter displays, as compared to traditional LCD technology. OLEDs use a series of thin, light-emitting films, which enables the display to produce brighter li... » read more

Chasing After Quantum Dots

By Mark LaPedus - 21 Sep, 2015 - Comments: 2

In the 1980s, researchers stumbled upon a tiny particle or nanocrystal with unique electrical properties. These mysterious nanocrystals, which are based on semiconductor materials, were later named quantum dots. Quantum dots were curiosity items until 2013, when Sony launched the world’s first LCD TV using these inorganic semiconductor nanocrystals. Basically, when inserted into an LCD TV,... » read more

Bigger, Brighter TVs

By Mark LaPedus - 24 Jul, 2015 - Comments: 0

The flat panel display (FPD) industry is undergoing a renaissance, with suppliers rolling out a dizzying array of new, high-resolution technologies for mobile devices, computers and TVs. But despite being in the eye of the innovation storm, FPD equipment makers remain cautious—and for good reason. There are a slew of new LCD fabs being built today, mostly in China. This, in turn, is promp... » read more

5 Technologies To Watch

By Mark LaPedus - 23 Jul, 2015 - Comments: 0

The industry is developing a dizzying array of new technologies. In fact, there are more new and innovative technologies than ever before. And the list is countless. At least from my vantage point, I have come up with my own list of the top five technologies to watch in 2015 and beyond. They are listed in alphabetical order. (See below). Obviously, there are more than just five technologi... » read more

Manufacturing Bits: Jan. 27

By Mark LaPedus - 27 Jan, 2015 - Comments: 0

Calibration systems go portable The National Institute of Standards and Technology (NIST) is selling a new portable, vacuum-based calibration unit for use in instruments and other systems. The system, dubbed the Portable Vacuum Standard (PVS), is a compact unit that enables precise calibrations and measurements at a customer’s facility. Housed in the white “igloo” enclosure, the syste... » read more

Manufacturing Bits: Nov. 11

By Mark LaPedus - 11 Nov, 2014 - Comments: 0

Plastic smartwatch displays LG Display has begun production of what the company claims is the world’s first circular plastic OLED (P-OLED) display. The P-OLED is the display for the company’s new smartwatch, the LG G Watch R. Based on the Android Wear operating system, the smartwatch is powered by Qualcomm’s 1.2-GHz Snapdragon 400 processor. It also has 4GB of storage and 512MB of RAM... » read more

OLED Displacing LCD, But Not Affecting Industry Leaders

By Michael Watts - 25 Jun, 2013 - Comments: 0

By Michael P.C. Watts One of the most common themes in high tech is how companies fail to deal with game-changing new products. Think about Kodak and digital cameras, Sony and the flash memory music player, Microsoft and the tablet, GE and Osram and the Light Emitting Diode (LED). The overwhelming conclusion seems to be that you have to be committed to making your own most valuable product red... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer