Week In Review: Design, Low Power


Electronic system design (ESD) industry revenue is up 8.9% from $3,458.2 million in Q3 2021 to $3,767.4 million in Q3 2022 according to a report from SEMI’s ESD Alliance. Read our in-depth take on what this means. In an attempt to make a viable reusable DNA biosensor probe, NIST researchers used an extremely low-power FETdeveloped at CEA-LETI to remove noise in their DNA biosensor circuitr... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, Mobility Automotive chip shortages will continue until 2025, according to reports in a Financial Times (FT) article. Demand for SiC power chips will remain high. Onsemi reportedly is already sold out of the power semiconductors. Archer Aviation’s Midnight eVTOL (electric vertical take-off and landing) is listed in the Federal Register now by The U.S. Federal Aviation Administr... » read more

Week In Review: Semiconductor Manufacturing, Test


U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Chip Industry Earnings: A Mixed Bag


Editor's Note: Updated the week of Oct. 31 and Nov. 7 for additional earnings releases. Although most companies reported revenue growth, this latest round of chip industry earnings releases reflected a few major themes: Lower future quarter guidance to varying degrees, due to the recent U.S. export restrictions related to China; Negative impact of the inflationary environment on corn... » read more

Blog Review: July 20


Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Week In Review: Design, Low Power


Tools & IP MIPS announced its first products based on the RISC-V ISA. The eVocore IP cores are designed to provide a flexible foundation for heterogeneous compute, supporting combinations of eVocore processors as well as other accelerators, with a Coherence Manager that maintains L2 cache and system-level coherency between all cores, main memory, and I/O devices. They target high-performan... » read more

Auto Chipmakers Dig Down To 10ppb


How do engineers deliver 10 defective parts per billion (Dppb) to auto makers if they only screen 1 million parts per year? Answer: By comprehending failure mechanisms and proactively screening for them. Modern automobiles contain nearly 1,000 ICs that must perform over the vehicle’s life (15 years). This drives quality expectations ever higher. While 10 Dppm used to be a solid benchmark, ... » read more

Zonal Architectures Play Key Role In Vehicle Security


The automotive ecosystem is starting to shift toward zonal architectures, making vehicle functionality less dependent on the underlying hardware and allowing more flexibility in what gets processed where. The impact of that shift is both broad and significant. For carmakers, it could lead to hardware consolidation and more options for failovers in case something goes wrong with any system in... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The U.S. Department of Energy (DOE) is funding 25 cleaner car and truck projects with $199 million. Projects include long-haul trucks powered by batteries and fuel cells, and at improving the nation’s electric vehicle (EV) charging infrastructure. The Volvo Group North America (VGNA) will receive $18 million in federal funds under DOE’s  SuperTruck 3 Program. Daimler Trucks N... » read more

Inspecting, Testing, And Measuring SiC


Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

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