tag: Open Model Interface

Reliability Concerns Shift Left Into Chip Design
By Ann Mutschler - 22 Dec, 2021 - Comments: 1

Demand for lower defect rates and higher yields is increasing, in part because chips are now being used for safety- and mission-critical applications, and in part because it's a way of offsetting rising design and manufacturing costs. What's changed is the new emphasis on solving these problems in the initial design. In the past, defectivity and yield were considered problems for the fab. Re... » read more

Adding Circuit Aging To Variability
By Brian Bailey - 12 Aug, 2021 - Comments: 0

Moving to a smaller node usually means another factor becomes important. The industry has become accustomed to doing process, temperature, voltage (PVT) corner analysis, but now it has to add aging into that mix. The problem is that planning for circuit aging is no longer a purely statistical process. Aging is dependent on activity over the lifetime of the device. Tools need to be modified a... » read more

Aging Analysis Common Model Interface Gains Momentum
By Greg Curtis - 25 Mar, 2021 - Comments: 0

By Greg Curtis, Ahmed Ramadan, Ninad Pimparkar, and Jung-Suk Goo In February 2019, Siemens EDA wrote an article1 entitled “The Time Is Now for a Common Model Interface”. Since that time, we have continued to see increasing demand for aging analysis, not only in the traditional automotive space, but also in other areas of technology design, such as mobile communication and IoT application... » read more

Aging Problems At 5nm And Below
By Brian Bailey - 11 Jun, 2020 - Comments: 3

The mechanisms that cause aging in semiconductors have been known for a long time, but the concept did not concern most people because the expected lifetime of parts was far longer than their intended deployment in the field. In a short period of time, all of that has changed. As device geometries have become smaller, the issue has become more significant. At 5nm, it becomes an essential par... » read more

Aging Analysis Standard Solidifies Through Collaborative Effort
By Ahmed Ramadan - 12 Mar, 2020 - Comments: 0

By Ahmed Ramadan, Greg Curtis, Harrison Lee, Jongwook Kye, and Sorin Dobre We live in a connected world and it is estimated that by 20251 the total amount of worldwide data will swell to 163 ZB, or 163 trillion gigabytes. This rapid growth in data expansion is driving an explosion in new designs and new requirements for consumer, data center, automotive, and Internet of Things (IoT) applicat... » read more

The Time Is Now For A Common Model Interface
By Ahmed Ramadan - 28 Feb, 2019 - Comments: 0

By Ahmed Ramadan and Greg Curtis Driven by consumer demand for “cheaper, faster, and better,” the semiconductor industry is continually pushing the migration to smaller process geometries. This continued scaling of complex designs into advanced process nodes is critical for applications ranging from high-performance computing to low-power mobile devices. In the past, products like sma... » read more

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