Executive Briefing: Stacking The Odds

By Ed Sperling - 29 May, 2013 - Comments: 0

Open-Silicon CEO Naveed Sherwani talks with System-Level Design about progress on 2.5D and 3D stacked die, why this approach is inevitable, when it will begin and what markets will use it first. [youtube vid=mzwpgDKuIok] » read more

Beyond Software: The Virtual-Machine Supply System

By The SE Staff - 25 Apr, 2013 - Comments: 0

It’s no secret that EDA and IP companies have had to expand their coverage into the larger system market, thanks to changes in the semiconductor supply chain. Around 2000, the industry was very fragmented. Mobile-chip and IP vendors worked with handset makers, who then partnered with operating-system (OS) suppliers and finally network operators. The next 12 years resulted in various combinati... » read more

Diverging Viewpoints

By Ed Sperling - 28 Mar, 2013 - Comments: 0

By Ed Sperling The raw materials of semiconductor design include smart, well-trained people and money to fund good ideas from those people, whose backgrounds typically come from engineering, math, physics, computer science, materials science and sometimes even chemistry. While many experts, executives, and industry groups have been sounding the alarm in recent years about everything from la... » read more

The Evolving Interconnect

By Ann Mutschler - 28 Mar, 2013 - Comments: 0

By Ann Steffora Mutschler Chip interconnect protocol requirements are evolving as designs move to 20nm and below process geometries, and not always in predictable ways. At least part of this is being driven by what an SoC is used for. The continued push to shrink features opens up real estate at each new process node. For the past decade, that real estate has been used to add more featu... » read more

Smarter Things

By Ed Sperling - 28 Feb, 2013 - Comments: 0

By Ed Sperling SoC design has largely been a race to the next process node in accordance with Moore’s Law, but it’s about to take a sharp turn away from that as the Internet of Things becomes more ubiquitous. There has been much made about the Internet of Things over the past couple of years—home networks that involve smart refrigerators sending reminders to consumers that the milk is... » read more

Mythbusting: Co-Design

By Ed Sperling - 28 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler It turns out that while there needs to be understanding between hardware and software engineers, the people doing the programming don’t actually want or need to interact. There is not, nor probably ever will be, one single team with hardware and software engineers happily working together on a project. But it’s not a total disconnect. There are a number o... » read more

The New Platform-Based Design

By Ann Mutschler - 28 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler Driven by the continued explosion in design costs, the term ‘platform-based design’ is evolving. A platform used to be viewed as an actual chip with some configurability on it that a semiconductor company promoted. Their customers would buy that chip in volume, configure it to their requirements, and sell it inside their end devices. The definition has beco... » read more

The Rise Of Layout-Dependent Effects

By Ann Mutschler - 28 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler Designing for today’s advanced semiconductor manufacturing process nodes brings area, speed, power and other benefits but also new performance challenges as a result of the pure physics of running current through tiny wires. Layout-dependent effects (LDE), which emerged at 40nm and are having a larger impact at 28 and 20nm, introduce variability to circuit ... » read more

SoC Architects Face Big Challenges

By Ed Sperling - 31 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler While the geometries of advanced node processes such as 28nm and below may not greatly impact SoC architectures, the complexity enabled by the leading edge brings intense challenges all the same. With the ability to put more transistors onto a chip come new possibilities such as the increasing use of multi-core architectures and lots of integrated hardware en... » read more

Cost Per Transistor Gets Fuzzier

By Ed Sperling - 31 Jan, 2013 - Comments: 0

By Ed Sperling Cost per transistor always has been a major reason for chipmakers to migrate to the next process node. By shrinking transistors and adding more logic, performance usually gets a boost. Moreover, that usually provides enough engineering wiggle room to add some improvements in energy efficiency. The basic assumption that you can double the number of transistors every 24 months,... » read more

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Knowledge Centers
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