tag: Open-Silicon

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Week In Review: Design
By Jesse Allen - 30 Sep, 2016 - Comments: 0

Numbers EDA and IP sales increased 5.6% in Q2 to $2.013 billion, up from $1.907 billion in the same period in 2015, according to the most recent Electronic System Design Alliance numbers. Asia/Pacific revenue increased 10.9% to $608.1 million; Japan increased 15.7% to $211.4 million. The Americas increased 4.4% to $908.4 million. IP Cadence launched the latest generation of its Xtensa ... » read more

The Week In Review: IoT
By Jeff Dorsch - 10 Jun, 2016 - Comments: 0

Design Automation Conference ARM Holdings announced that its DesignStart initiative to enable easy creation of chip designs using ARM Cortex-M0 intellectual property now takes in electronic design automation tools and design environments offered by Cadence Design Systems and Mentor Graphics. “Simplifying access to EDA tools from Cadence and Mentor Graphics will further spur rapid innovation,... » read more

IP Risk Sharing
By Brian Bailey - 10 Mar, 2016 - Comments: 0

For most people within the semiconductor industry, managing risk involves making the right product decisions that will enable a company to be profitable, and ensuring the product is successfully produced within the necessary time window. In contrast, for products within high-risk areas such as medical and mil/aero, design often proceeds at a slower pace, using proven technologies and adopting l... » read more

IP Requirements Changing
By Brian Bailey - 25 Feb, 2016 - Comments: 0

Twenty years ago the electronics industry became interested in the notion of formalizing re-use through third-party IP. It has turned out to be harder than anyone imagined. In 1996, the Virtual Socket Interface Alliance ([getentity id="22845" comment="VSIA"]) was formed to standardize the development, distribution and licensing of IP. Soon afterward, companies with a couple of people in a ga... » read more

Advanced Packaging Is Real. Now What?
By Ed Sperling - 14 Jan, 2016 - Comments: 0

For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

The Week In Review: Design/IoT
By Jesse Allen - 13 Nov, 2015 - Comments: 0

Predictions Wally Rhines, Mentor Graphics' chairman and CEO, was presented with the Kaufman Award last night for outstanding achievement in electronic design. In his acceptance speech, he plotted the growth of the EDA industry at a consistent 2% of the semiconductor industry for the past couple decades. But he noted that with a shift to system design automation, that number would rise from t... » read more

Security In 2.5D
By Ed Sperling - 12 Oct, 2015 - Comments: 2

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

The Week In Review: Design/IoT
By Jesse Allen - 02 Oct, 2015 - Comments: 0

EDA industry revenue increased 8.5% for Q2 2015 to $1906.5 million, according to the latest report from the EDA Consortium. The four-quarters moving average, which compares the most recent four quarters to the prior four quarters, also increased by 8.5%. IP showed continued strength, with revenue totalling $611.7 million in Q2 2015, a 15% increase compared to Q2 2014; the four-quarters moving a... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

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