tag: Oppo

Competing V2V Technologies Emerge, Create Confusion
By John Koon - 05 Jan, 2023 - Comments: 0

The battle over vehicle-to-vehicle communications technology has begun, as governments step back to see which of two main competing standards and lots of related technology are best suited for reducing accidents. V2V is an often-discussed wireless communication protocol that enables vehicles to communicate with each other, easing traffic congestion, avoiding accidents, and ultimately improvi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 16 Dec, 2022 - Comments: 0

Automotive, mobility Automaker Toyota and Texas-based electricity distributor Oncor Electric Delivery (Oncor) are embarking on a vehicle-to-grid (V2G) pilot project to explore the feasibility of transferring energy from BEVs’ batteries back to the grid. Toyota and Oncor want to better understand the interconnectivity between BEVs and utilities. The project will start testing at Oncor’s res... » read more

Startup Funding: December 2021
By Jesse Allen - 04 Jan, 2022 - Comments: 0

Chinese startups dominated last month's fundraising, with companies from the country comprising about two-thirds of those covered in this report. In addition to the number of companies, startups from China also drew significant amounts of funding, with a display driver company and an EV battery maker each garnering around $1B and six more companies seeing rounds over $100M. Two particularly ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Jul, 2021 - Comments: 0

Security Xilinx is investing an undisclosed amount in fabless semiconductor startup Kameleon Security, which is working on a cyber protection chip for servers, data centers, and cloud computing. The proactive Security Processing Unit (ProSPU) already secures the boot and has a root of trust (RoT). The chip will be demonstrated at the Open Compute Project (OCP) Global Summit, which is planned f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 May, 2021 - Comments: 0

Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Apr, 2021 - Comments: 0

Chipmakers and OEMs Intel wants $9.7 billion in subsidies for use in building a leading-edge fab in Europe, according to a report from Reuters. As reported, in March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Eighteen members of the European Union recently launched an ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jan, 2021 - Comments: 0

Packaging and test Intel has invested an additional $475 million in its chip assembly and test manufacturing facility in the Saigon Hi-Tech Park (SHTP) in Vietnam. This takes Intel’s total investment in the Vietnam facility to $1.5 billion. The site assembles and tests Intel’s 5G products and processors. TSMC recently announced a huge increase in capital spending for 2021. A large perce... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Aug, 2018 - Comments: 0

Trade wars After opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, recently spoke out against an additional $16 billion in duties on Chinese goods. The tariffs do little to address U.S. concerns over IP loss, according to SEMI. Over the past month, SEMI has also submitte... » read more

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