Momentum Builds For Advanced Packaging


The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

The Good And Bad Of Chiplets


The chiplet model continues to gain traction in the market, but there are still some challenges to enable broader support for the technology. AMD, Intel, TSMC, Marvell and a few others have developed or demonstrated devices using chiplets, which is an alternative way to develop an advanced design. Beyond that, however, the adoption of chiplets is limited in the industry due to ecosystem issu... » read more

Waiting For Chiplet Interfaces


There aren't many success stories related to chiplets today for a very simple reason—there are few standard interfaces defined for how to connect them. In fact, the only way to use them is to control both sides of the interface with a proprietary interface and protocol. The one exception is the definition of HBM2, which enables large quantities of third-party DRAM to be connected to a logi... » read more

Die-to-Die Interconnects for Chip Disaggregation


Today, data growth is at an unprecedented pace. We’re now looking at petabytes of data moving into zettabytes. What that translates to is the need for considerably more compute power and much more bandwidth to process all that data. In networking, high-speed SerDes PHYs represent the linchpin for blazing fast back and forth transmission of data in data centers. In turn, demand is increa... » read more