Technology Tsunami Approaches

By Brian Bailey - 27 Jul, 2015 - Comments: 0

How many times have we heard the saying that technology advancements are accelerating and that inevitably the older generation will have increasing problems keeping up with the new advancements? This happened to me with software development methodologies over fifteen years ago. I still program, when people actually let me, using basically the same techniques I learned when I was in my teens.... » read more

Manufacturing Bits: August 5

By Mark LaPedus - 05 Aug, 2014 - Comments: 0

Double Big Mac chips Using molecular beam epitaxy (MBE), Cornell has devised a method of growing an emerging class of oxide films called Ruddlesden-Poppers. These oxides are layered structures, which consist of 2D-based perovskite slabs interleaved with cations. In the future, these structures could be used in various applications, such as superconductivity, magnetoresistance and ferromagne... » read more

Manufacturing Bits: Oct. 29

By Mark LaPedus - 29 Oct, 2013 - Comments: 0

Diamond chips The optical transistor, which transports photons, holds great promise. Photons are not only faster than electrons, but they have less crosstalk. But optical transistors are also expensive and difficult to produce. In a possible breakthrough, the ICFO-Institute of Photonic Sciences has demonstrated a “nano-size” diamond that can act as an efficient optical switch. Researche... » read more

Manufacturing Bits: Aug. 27

By Mark LaPedus - 27 Aug, 2013 - Comments: 0

Growing tubes Single-wall carbon nanotubes could one day be used in electronics, optoelectronics, biomedical imaging and other applications. But the synthesis of nanotubes with defined chiralities has been a stumbling block. A chiral molecule is a molecule that has a non-superposable mirror image. The University of Southern California has shown that chirality-pure short nanotubes can be use... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: optical

Technology Tsunami Approaches

Manufacturing Bits: August 5

Manufacturing Bits: Oct. 29

Manufacturing Bits: Aug. 27