Predicting And Avoiding Failures In Automotive Chips


Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

Transforming Vision Inspection With Machine Learning


How auto-manufacturers can apply ML & AI algorithms to enhance image analytics on their factory floor and to ensure higher product quality? Discover the next generation visual inspection in our new case study. In this case study , you will learn about: Current limitations of image inspection in the manufacturing industry. The O+ end-to-end solution, which brings machine learning and... » read more

Industry 4.0 And The Rise Of QPaaS


McKinsey & Company frames this shift as a matter of moving the industry from its current approach of “firefighting” – responding to failures and vulnerabilities after they’re brought to OEMs’ attention – toward proactively preventing such episodes in the first place. How can the industry achieve this objective? By embracing quality protection as a service (QPaaS) — an approach... » read more

Making Chips To Last Their Expected Lifetimes


Chips are supposed to last their lifetime, but that expectation varies greatly depending upon the end market, whether the device is used for safety- or mission-critical applications, and even whether it can be easily replaced or remotely fixed. It also depends on how those chips are used, whether they are an essential part of a complex system, and whether the cost of continual monitoring and... » read more

Demand Grows For Reducing PCB Defects


Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This represents a significant shift from the past, where concerns about reliability primarily targeted the devices connected to printed circuit boards. But as SoCs become disaggregated into advanced packages... » read more

Better Analytics Needed For Assembly


Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

New Uses For Manufacturing Data


The semiconductor industry is becoming more reliant on data analytics to ensure that a chip will work as expected over its projected lifetime, but that data is frequently inconsistent or incomplete, and some of the most useful data is being hoarded by companies for competitive reasons. The volume of data is rising at each new process node, where there are simply more things to keep track of,... » read more

Cloudy With A Chance Of Better Analytics


How can you create product-oriented analytics on the factory floor while leveraging cloud capabilities at the same time? In our article, you will learn about: The importance of moving from machine analytics to product analytics. The benefits of migrating your analytics infrastructure to the cloud. How OptimalPlus successfully partnered with AWS to create an end-to-end analytics so... » read more

Defect Image Classification And Detection With Deep Learning


Authors: Dan Sebban and Nissim Matatov Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of images that are acquired by a multitude of means such as optical, X-ray, infrared, acoustic microscopy. In contrast to automatic inspections, traditional visual inspec... » read more

The Growing Challenges Of 5G Reliability


The test field is getting more complicated as chips become larger, more heterogeneous, and subject to almost constant changes. Nowhere is this more evident than in 5G, where standards are still evolving and use cases are still being defined. Without passing test, no technology advances. But those definitions are subject to change, and they can change again over time. The communications in... » read more

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