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• Dr. Subhash L. Shinde , Booz Allen, Ex. Univ. of Notre Dame, Ex. Sandia National Labs., Ex. IBM. on The Race To Glass Substrates
• Traian MUNTEAN (Honorary Professor) on A Balanced Approach To Verification
• Amba Prasad on HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)
• sam on HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)
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• N. L. Kamaruzzaman on Security Risks Mount For Aerospace, Defense Applications
• IT on Three-Way Race To 3D-ICs
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• Andrew Johnston on Strain, Stress In Advanced Packages Drives New Design Approaches
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• Dr Dev Gupta on Innovations Driving The Advanced Packaging Roadmap: Part One
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• Santanu on Rethinking Engineering Education In The U.S.
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• Theodore Wilson on Shift Left Is The Tip Of The Iceberg
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• A Duck on Batteries Look Beyond Lithium
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• Allan Cox on Big Changes Ahead For Analog Design
• S on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• AI Research Scientist on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• Paul Karazuba on A Buyers Guide To An NPU
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• Gan Future on Week In Review: Design, Low Power
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• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
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• Laura Peters on Key Technologies To Extend EUV To 14 Angstroms
• Tsumoru Shintake @ OIST on Key Technologies To Extend EUV To 14 Angstroms
• Ev Roach on Will AI Disrupt EDA?
• Dr David Serena on Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging
• Jerome Poussin on Navigating the Metrology Maze For GAA FETs
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• David Leary on Heat-Related Issues Impact Reliability In Advanced IC Designs
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• Tarhib IT Limited on Improving Redistribution Layers for Fan-out Packages And SiPs
• Tarhib IT Limited on Glass Substrates Gain Foothold In Advanced Packages
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