中文 English

Design-Aware Data Management For Hybrid Cloud


Working from home is quickly becoming the norm. A recent survey by FlexJobs found that 70% of people would prefer a remote working environment over a traditional one. Working from home has become even more popular in the semiconductor design industry. Companies are now implementing design-aware data management for hybrid cloud to meet evolving design data management requirements. Why has workin... » read more

Made in the Cloud!


While software developers have been building and delivering software in the cloud for many years now, how much IC hardware is “made in the cloud”? We’re here to help you understand the case for IC hardware development in the cloud and answer the most common questions. Download the paper and learn: Why isn’t everybody doing it? Why cloud? Why now? Can you afford to ignore i... » read more

EDA On Cloud Presents Unique Challenges


Discussions about cloud-based EDA tools are heating up for both hardware and software engineering projects, opening the door to vast compute resources that can be scaled up and down as needed. Still, not everyone is on board with this shift, and even companies that use the cloud don't necessarily want to use it for every aspect of chip design. But the number of cloud-based EDA tools is growi... » read more

How To Justify A Data Center


The breadth of cloud capabilities and improvements in cost and licensing structures is prompting chipmakers to consider offloading at least some of their design work into the cloud. Cloud is a viable business today for semiconductor design. Over the past decade, the interest in moving to cloud computing has grown from an idea that was fun to talk about — but which no one was serious about ... » read more

Assuring Reliable Processor Performance At Scale


In today’s data center environment, resilience is key. Cloud providers are built on as-a-service business models, where uptime is critical to ensure their customers’ business continuity. Reputation and competitiveness require service at extremely high performance, low power, and increasing functionality, with zero tolerance for unplanned downtime or errors. If you’re a hyperscaler, o... » read more

Open RAN Direct RF Sampling Radio Transceiver Architectures For Massive MIMO


With the exponential increase in wireless traffic, mobile networks are transformed into more software-driven, virtualized, flexible, intelligent, and energy efficient systems. These trends have stimulated significant change in the core network with the advent of software defined networks (SDN) and network functions virtualization (NFV), which have enabled building more agile and less expensive ... » read more

Building Multipurpose Systems With Dynamic Function Exchange Part Two: Bundling And Managing Resources


In our previous article, we mentioned that one of the most-common oversights that designers can make is to not fully use available system resources, and we introduced you to the concept of Dynamic Function Exchange (DFX), a design approach that dynamically reallocates unused system resources to other tasks. From a technical standpoint, implementing DFX is relatively straightforward using a c... » read more

EDA In The Cloud Is Driving Semiconductor Innovation


In the past decade, the move towards cloud computing occurred primarily in sectors like finance, retail, and healthcare, with the emergence of leading public cloud vendors such as Amazon Web Services (AWS), Microsoft Azure, Google Cloud Platform, and others accelerating the trend. However, the chip design industry has been slower to adopt cloud computing. In the current highly competitive en... » read more

Next Steps For Panel-Level Packaging


Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Enablers And Barriers For Connecting Diverse Data


More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

← Older posts