Module Testing Adds New Challenges


System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is something more than a chip package and a great deal smaller than most printed circuit boards. Testing these modules often requires system-level test. These modules typically will be inserted int... » read more

Who’s Responsible For Transistor Aging Models?


While there are a number of ways to go about reliability and transistor aging analysis, it is all in large part dependent on fabs and foundries to provide the aging models. The situation is also not entirely clear in the semiconductor ecosystem because the classic over-the-wall mentality between design and manufacturing still exists. And unfortunately this wall is bi-directional. Not only... » read more

Listening To The Voice Of Your Product


Much has been said and written about the business values of the Industrial Internet of Things (IIoT). Through connecting the manufacturing elements (machines) on the factory floor, and collecting and analyzing their data, manufacturers can significantly improve the efficiency and profitability of their operations through intelligent predictive maintenance of equipment and optimal equipment ut... » read more

Testing IoT Devices


Internet of Things devices present new challenges in testing. Some devices can be tested the same way as standard semiconductors are now tested, but others call for different approaches. Microcontrollers and other chips that go into safety-critical applications — medical devices, military/aerospace systems, and automotive electronics — need their own kind of testing to make sure they wil... » read more

Is Product Quality Getting Lost In The IIoT?


Manufacturing operations have continuously evolved using data capture and management to assess and test production effectiveness on the manufacturing floor. The advent of the Industrial Internet of Things (IIoT) and its anticipated ability to track and manage the factory environment with machine-to-machine process analytics heralds yet another transformation, promising a higher level of data in... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

Data Leakage And The IIoT


The Internet of Things has raised concerns about people hacking into home networks or using armies of bots to disrupt communications. But with the Industrial IoT, the stakes are significantly higher—and the effects can last much longer. Security tops the list of concerns as more industrial equipment is connected to the Internet, according to numerous industry insiders. That hasn't stopped ... » read more

Quality Issues Widen


As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

Outlier Detection


With increasing focus on quality and reliability across all segments beyond just automotive, medical and mil-aero, it is more critical than ever for companies to leverage every byte of test data at their disposal to ensure that they deliver the lowest possible DPPM (defective parts per million) rates to their customers. Semiconductor manufacturing operations now generate up to 100TB of test ... » read more

Betting On Wafer-Level Fan-Outs


Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

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