Better Analytics Needed For Assembly


Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

Monitoring IC Abnormalities Before Failures


The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how long that projected lifespan. Engineers have long used on-chip circuitry to assist with manufacturing test, silicon debug and failure analysis. Providing visibility and controllability of inter... » read more

How To Improve DPPM By 10X Without Affecting Yield


Chips today are under immense pressure. With wider process variation manifested at wafer and die levels in single-digit nodes, highly complex designs, and effects of application and system integration, it’s no wonder the electronics value chain is becoming ever more reliant on expensive guard-bands. The ecosystem is not yet equipped to find all existing defects during test. So while quality e... » read more

Using Fab Sensors To Reduce Auto Defects


The semiconductor manufacturing ecosystem has begun collaborating on ways to effectively use wafer data to meet the stringent quality and reliability requirements for automotive ICs. Silicon manufacturing companies are now leveraging equipment and inspection monitors to proactively identify impactful defects prior to electrical test. Using machine learning techniques, they combine the monitor ... » read more

Sensing Automotive IC Failures


The sooner you detect a failure in any electronic system, the sooner you can act. Together, data analytics and on-chip sensors are poised to boost quality in auto chips and add a growing level of predictive maintenance for vehicles. The ballooning number of chips cars makes it difficult to reach 10 defective parts per billion for every IC that goes into a car.  And requiring that for a 15-y... » read more

Redefining Device Failures


Can a 5nm or 3nm chip really perform to spec over a couple decades? The answer is yes, but not using traditional approaches for designing, manufacturing or testing those chips. At the next few process nodes, all the workarounds and solutions that have been developed since 45nm don't necessarily apply. In the early finFET processes, for example, the new transistor structure provided a huge im... » read more

Cloudy With A Chance Of Better Analytics


How can you create product-oriented analytics on the factory floor while leveraging cloud capabilities at the same time? In our article, you will learn about: The importance of moving from machine analytics to product analytics. The benefits of migrating your analytics infrastructure to the cloud. How OptimalPlus successfully partnered with AWS to create an end-to-end analytics sol... » read more

Big Problems In A Little Data World


Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor industry. Titled “I’m Living in a Little Data World, but I Have a Big Problem,” Rick talked about the challenges faced by the “little data world” of process development and the potential for ... » read more

Using Machine Learning To Gain Data Insights


Today’s consumers have little appetite for networks that go down, for electronic devices that fail, and for any kind of digital service that doesn’t deliver as promised every time. Reliability is no longer a nice-to-have. It's  a key feature. The continued scaling of advanced electronics and chip manufacturing technologies, however, makes reliability harder to achieve — even as expectati... » read more

Making 3D Structures And Packages More Reliable


The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

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