Chip Industry Technical Paper Roundup: July 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=426 /] Find more semiconductor research papers here. » read more

Analytical Methods For Analyzing PFAS In Semiconductor Wastewater (Oregon State University)


A new technical paper titled "Practical Guidance on Selecting Analytical Methods for PFAS in Semiconductor Manufacturing Wastewater" was published by researchers at Oregon State University, Corvallis. Abstract "The focus of this review is to provide an overview of the nomenclature, structure, and properties of perfluoroalkyl and polyfluoroalkyl substances (PFAS) that dictate the selection o... » read more

Research Bits: May 13


Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

Research Bits: Apr. 29


Microchannels for two-phase cooling Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The method utilizes microfluidic channels to create a capillary structure through which coolant flows and a manifold distribution layer that controls the distribution of coolant. The structure enabled two-phase cooling through better managem... » read more

Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications


A new technical paper titled "Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling" was published by researchers at Carnegie Mellon University, Oregon State University and Arieca. Abstract "Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inev... » read more

Research Bits: Jan. 7


Deep UV microLED for maskless lithography Researchers from the Hong Kong University of Science and Technology, Southern University of Science and Technology, and the Suzhou Institute of Nanotechnology developed an aluminum gallium nitride deep-ultraviolet microLED display array for maskless lithography.  They also built a maskless lithography prototype platform. "The team achieved key brea... » read more

Chip Industry Technical Paper Roundup: Nov. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Chip Industry Week In Review


CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

Analysis And Design Of Dual-Layer TFTs (Oregon State Univ., Applied Materials)


A new technical paper titled "Dual-Layer Thin-Film Transistor Analysis and Design" was published by researchers at Oregon State University and Applied Materials. Abstract "A set of analytical equations is formulated for the analysis and design of a dual-layer thin-film transistor (TFT). For a given TFT structure, in which each channel layer thickness is specified, drain current is calculate... » read more

Research Bits: June 25


Quantum on silicon Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) developed a platform to probe and control qubits in silicon for quantum networks, after an earlier discovery that defects in silicon could be used to send and store quantum information over widely used telecommunications wavelengths. The device uses an electric diode to manipulate... » read more

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