From Uncertainty To New Markets

By Bettina Weiss - 18 Aug, 2016 - Comments: 0

The 11th annual SEMI/Gartner Market Symposium at SEMICON West 2016 presented diverse perspectives on trends and developments in the macroeconomic environment as well as the semiconductor manufacturing supply chain. The themes have significant and immediate impact on the industry and include economic uncertainty, Brexit, China’s ambitious plans for an indigenous chip industry, and evolving end... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 25 Mar, 2016 - Comments: 0

Chipmakers In a blog, GlobalFoundries discussed the global push towards 5G or fifth-generation wireless networks. Samsung Electronics Australia has announced the creation of brainBAND, a wearable technology designed to facilitate research into concussions in sports. In the prototype, a headband houses sensors at the back of the head that measure the force of an impact. This information wou... » read more

What’s Next For DRAM?

By Mark LaPedus - 24 Feb, 2016 - Comments: 2

The DRAM business has always been challenging. Over the years, DRAM suppliers have experienced a number of boom and bust cycles in a competitive landscape. But now, the industry faces a cloudy, if not an uncertain, future. On one front, for example, [getkc id="93" kc_name="DRAM"] vendors face a downturn amid a capacity glut and falling product prices in 2016. But despite the business chal... » read more

Reflections On 2015

By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

More Choices, Less Certainty

By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

SEMICON Taiwan’s Packaging Punch

By SEMI - 17 Sep, 2015 - Comments: 0

SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

Advanced IC Packaging Biz Heats Up

By Mark LaPedus - 20 Aug, 2015 - Comments: 0

After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more

Equipment Market Drifts Downward

By Ed Sperling - 17 Jul, 2015 - Comments: 0

Most analysts covering the equipment market have dropped their forecasts, some by as much as half, since the start of the year. While there are a number of variables that could ultimately change those numbers—the Greek debt crisis, currency fluctuations, server sales, the delivery of a commercially viable EUV—the bottom line is that the market is looking more skittish. Dan Tracy, SEMI's ... » read more

Front End Comes To The Back End

By Jeff Chappell - 19 Sep, 2013 - Comments: 0

By Jeff Chappell For outsourced assembly and test (OSAT) houses either planning for or already offering through-silicon via (TSV) capability for their 3D packaging efforts, this has meant the front end is coming to the back end, in a manner of speaking. A bit of an exaggeration perhaps, as most generalizations are. But thanks to TSVs, in a very real sense some of what would typically be the... » read more

Experts at the Table: Stacking the Deck

By Ed Sperling - 23 Aug, 2012 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss challenges to 3D-IC adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson, product marketing director at Mentor Graphics; Karthik Chandrasekar, member of technical staff in IC Design at Altera; and Herb Reiter, president of EDA2ASIC Consulting... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: OSAT