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Chip-Package Co-Analysis Using Ansys RedHawk-CPA


Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Executive Briefing: Andrew Yang


By Ed Sperling Andrew Yang, president of ANSYS subsidiary Apache Design, sat down with Low-Power/High-Performance Engineering to talk about why power is becoming so important and where the future challenges lie. What follows are excerpts of that conversation. LPHP: What’s the most important issue these days for chipmakers? Yang: According to the feedback we’ve gotten from our customer... » read more