tag: packaging

Co-Design Optimization For PI/SI When Considering Thermal Performance
By Peater Wu - 21 Apr, 2025 - Comments: 0

When applications become more complex, higher data rates or high frequencies are required. However, with increasing functions, more power dissipation will be generated. Furthermore, temperature is proportional to power dissipation, so electrical performance will also depend on thermal conditions. To determine how temperature impacts power integrity/signal integrity (PI/SI), electrical simulatio... » read more

Innovation And Collaboration In Power Module Packaging: A Thermal Perspective
By Thomas Wang - 17 Apr, 2025 - Comments: 0

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power. As the demand for more power in smaller and lighter systems grows, managing heat dissipation has become a major challenge, as the thermal energy from high current flows can lead to reliability issue... » read more

Packaging With Fewer People And Better Results
By Gregory Haley - 17 Apr, 2025 - Comments: 0

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Eliminating Interfacial Delamination in High-Power Automotive Devices
By Chin Joo Tan - 20 Mar, 2025 - Comments: 0

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at the same time, deliver consistent performances. Interfacial delamination is a significant factor that can impact the reliability performance of power devices. It refers to the separation of lay... » read more

Using Glass As A Dielectric In Electronic Packaging
By Dick Otte - 20 Mar, 2025 - Comments: 0

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with alternative materials. To this end, glass substrates have emerged as a promising alternative with distinct benefits for semiconductor packaging. Major chipmakers, including ... » read more

AI And Semiconductor In Reciprocity
By Mike Hung - 20 Mar, 2025 - Comments: 0

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drive the development of semiconductor technologies, with both complementing each other. Semiconductor packaging: The bridge between chip an... » read more

Challenges Grow For Medical ICs
By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Energy Saving In Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization
By Arieff Yusoff - 20 Feb, 2025 - Comments: 0

In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals for semiconductor manufacturing processes. These alternatives aim to minimize hazards while promoting greater sustainability. Notably, this trend extends to exploring substitutes for conventional c... » read more

An Innovative Hybrid Cleaning Approach For Contaminant Removal in Semiconductor Packaging
By Chun Yuan Lim - 23 Jan, 2025 - Comments: 0

The growing demand for power semiconductors, which control large currents and voltages, has resulted in their widespread use in various electronic devices, including electric vehicles (EVs). The requirement for greater performance and smaller devices has led to increased operating temperatures for these power semiconductors. This rise in temperature poses a challenge as it often leads to delami... » read more

Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
By Vineet Pancholi - 21 Nov, 2024 - Comments: 1

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s website does a good job of detailing the anecdotal path of multi-die systems by way of chiplet building blocks integrated within a single package [2]. The presentation includes references to a ha... » read more

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