tag: packaging

Advanced Packaging: Driving Innovation, Performance, And New System Capabilities
By Cassandra Melvin - 18 Dec, 2025 - Comments: 0

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, even as the Moore’s Law roadmap for wafer-level scaling comes under strain. At the Advanced Packaging Conference during SEMICON Europa 2025 in Munich, global experts examined the growth tr... » read more

The Opportunities And Challenges Of FOPLP Technology
By Teck Lee - 23 Oct, 2025 - Comments: 0

Artificial intelligence (AI) has emerged as a major catalyst for innovation and advancement. The growing demand for AI computing power is driving heterogeneous integration toward larger packaging sizes, sparking increased interest in Fan-out Panel Level Package (FOPLP) technology. This article explores ASE’s practices and developments in this area, delving into the technical intricacies and e... » read more

Interconnect Innovations In High Bandwidth Memory: Part 2
By Damon Tsai - 14 Oct, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid bonding. Both technologies are evolving to address the stringent requirements of next generation HBM in pursuit of increased I/O density supporting high... » read more

A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)
By Technical Paper Link - 03 Oct, 2025 - Comments: 0

A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, University Bremen, Infineon and WavesenseDD GmbH. Abstract “Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant t... » read more

Enhancing Clip Attach Vision Accuracy In Semiconductor Manufacturing
By Mahenthren Palaniappan - 18 Sep, 2025 - Comments: 0

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, OSAT companies are entrusted with the critical task of assembly, testing, and packaging of devices. Maintaining quality in OSAT operations is of paramount importance, as it directly impacts the pe... » read more

Interconnect Innovations In High Bandwidth Memory: Part 1
By Damon Tsai - 09 Sep, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics. These technologies require access to vast datasets, which in turn increases the need for memory solutions that combine speed, density, and power efficie... » read more

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces
By MinJae Kong - 24 Jul, 2025 - Comments: 0

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) pa... » read more

The Rise Of Panel-Level Packaging
By Laura Peters - 24 Jul, 2025 - Comments: 0

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum reticle size in the next few years. These assemblies are best developed using fan-out panel-level packaging, replacing today’s wafer carrier with a panel. Fan-out packaging enables substantially... » read more

Using Picosecond Ultrasonic Technology For AI Packages: Part 2
By Cheolkyu Kim - 10 Jul, 2025 - Comments: 0

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve tremendous performance gains. However, the heterogeneous integration of advanced packages has its own set of process control obstacles that must be addressed, including new interconnect challenges invol... » read more

Path To Net-Zero Emissions In IC Packaging
By Louie Huang - 19 Jun, 2025 - Comments: 0

To strengthen climate resilience and accelerate towards net-zero emissions, ASE has implemented comprehensive carbon reduction strategies and management frameworks to practice responsible actions and achieve performance results. In our efforts to reduce our carbon footprint, we strive to design production facilities and processes that prioritize eco-efficient production and the creation of en... » read more

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