tag: packaging

The Rise Of Panel-Level Packaging
By Laura Peters - 24 Jul, 2025 - Comments: 0

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum reticle size in the next few years. These assemblies are best developed using fan-out panel-level packaging, replacing today’s wafer carrier with a panel. Fan-out packaging enables substantially... » read more

Using Picosecond Ultrasonic Technology For AI Packages: Part 2
By Cheolkyu Kim - 10 Jul, 2025 - Comments: 0

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve tremendous performance gains. However, the heterogeneous integration of advanced packages has its own set of process control obstacles that must be addressed, including new interconnect challenges invol... » read more

Path To Net-Zero Emissions In IC Packaging
By Louie Huang - 19 Jun, 2025 - Comments: 0

To strengthen climate resilience and accelerate towards net-zero emissions, ASE has implemented comprehensive carbon reduction strategies and management frameworks to practice responsible actions and achieve performance results. In our efforts to reduce our carbon footprint, we strive to design production facilities and processes that prioritize eco-efficient production and the creation of en... » read more

Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
By Cheolkyu Kim - 10 Jun, 2025 - Comments: 0

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the front-end of the process. In other words, the technologies that were once exclusively deployed in the first part of the process are being used to meet the increasingly stringent requirements of ad... » read more

Maximizing Signal Integrity: Fine-Tuning Via Impedance In HDFO Architectures
By Tsung Ting Lee - 22 May, 2025 - Comments: 0

The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO) is the routing scale. That aspect is also the challenge and focus of this study. At an HDFO scale, most of the electrical properties cannot be measured by instruments. Therefore, this study uses the indirect method to determine the impedance information of the via and match the impedance. Since the v... » read more

New Package Solutions for Automotive Optical Sensors
By Amkor - 22 May, 2025 - Comments: 0

This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for mic... » read more

Co-Design Optimization For PI/SI When Considering Thermal Performance
By Peater Wu - 21 Apr, 2025 - Comments: 0

When applications become more complex, higher data rates or high frequencies are required. However, with increasing functions, more power dissipation will be generated. Furthermore, temperature is proportional to power dissipation, so electrical performance will also depend on thermal conditions. To determine how temperature impacts power integrity/signal integrity (PI/SI), electrical simulatio... » read more

Innovation And Collaboration In Power Module Packaging: A Thermal Perspective
By Thomas Wang - 17 Apr, 2025 - Comments: 0

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power. As the demand for more power in smaller and lighter systems grows, managing heat dissipation has become a major challenge, as the thermal energy from high current flows can lead to reliability issue... » read more

Packaging With Fewer People And Better Results
By Gregory Haley - 17 Apr, 2025 - Comments: 1

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Eliminating Interfacial Delamination in High-Power Automotive Devices
By Chin Joo Tan - 20 Mar, 2025 - Comments: 0

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at the same time, deliver consistent performances. Interfacial delamination is a significant factor that can impact the reliability performance of power devices. It refers to the separation of lay... » read more

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