Managing EMI in High-Density Integration

By Gregory Haley - 19 Sep, 2024 - Comments: 0

The relentless drive for higher performance and increased functional integration has ushered in new challenges for managing electromagnetic interference (EMI) in densely packed mixed-signal environments. Integrating analog, RF, and digital circuits into a single system-on-chip (SoC) or advanced package requires solutions that reduce system size and improve performance. However, this tight in... » read more

High-Performance 5G IC Designs Need High-Performance Parasitic Extraction

By Karen Chow - 23 Jun, 2022 - Comments: 0

By Karen Chow and Salma Ahmed Elhenedy We are rapidly approaching a future where 5G telecommunications will be the norm. With its increased data speeds and bandwidth, 5G has the potential to change the way we live our lives. But what does that mean for the average person? Think about cellphones, for one. You don't just use your phone for calling or texting anymore—you surf the web, chec... » read more

Preparing For Electromagnetic Crosstalk Challenges

By Magdy Abadir - 11 Jan, 2018 - Comments: 0

By Magdy Abadir and Anand Raman Electromagnetic (EM) coupling/noise is not a new phenomenon, but increasing bandwidth and decreasing size, along with low-power demands of today’s electronic systems is making EM crosstalk a first order challenge. At clock frequency of 10GHz+ and data rate of 10Gbps+, parasitic inductance and inductive coupling that were previously safe to ignore are no long... » read more

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tag: parasitic inductance

Managing EMI in High-Density Integration

High-Performance 5G IC Designs Need High-Performance Parasitic Extraction

Preparing For Electromagnetic Crosstalk Challenges