What’s WAT? An Overview Of WAT/PCM Data


Wafer acceptance testing (WAT) also known as process control monitoring (PCM) data is data generated by the fab at the end of manufacturing and generally made available to the fabless customer for every wafer. The data will typically have between forty and one hundred tests, each test having a result for each site (or “drop-in”) on the wafer. The sites are located so that the fab can monito... » read more

DRAM, 3D NAND Face New Challenges


It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

Neuromorphic Computing Drives The Landscape Of Emerging Memories For Artificial Intelligence SoCs


The pace of deep machine learning and artificial intelligence (AI) is changing the world of computing at all levels of hardware architecture, software, chip manufacturing, and system packaging. Two major developments have opened the doors to implementing new techniques in machine learning. First, vast amounts of data, i.e., “Big Data,” are available for systems to process. Second, advanced ... » read more

Memory Issues For AI Edge Chips


Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

What’s WAT? Testing At The End Of Manufacturing


The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their area of expertise. On the other hand, the fabless company relies on the expertise and skills of the foundry to produce quality wafers. Many times a process used by a fabless company to manufacture... » read more

Logic Chip, Heal Thyself


If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

Manufacturing Bits: Dec. 16


Imec-Leti alliance At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Leti announced plans to collaborate in select areas. The two R&D organizations plan to collaborate in two areas—artificial intelligence (AI) and quantum computing. Imec and Leti have been separately working on AI technologies based on various next-generation memory architectures. Both entitie... » read more

Magnetic Memories Reach For Center Stage


Wearable heart rate sensors. Networked smoke detectors. Smart lighting. Smart doorbells. While desktop computers and even smartphones are powerful standalone tools, Internet of Things devices share a need to collect data from the environment, store it, and transmit it to some other device for action or further analysis. In many systems, data storage and working memory account for the majorit... » read more

Accurate Error Bit Mode Analysis Of STT-MRAM Chip With A Novel Current Measurement Module


Authors: (Advantest) Ryo Tamura, Ibuki Mori Naoyoshi Watanabe; (Tohoku University) Hiroki Koike, Tetsuo Endoh. A novel memory test system is needed for future STT-MRAM mass production that supports error bit analysis and its mode categorization on STT-MRAM chip measurement, as STTMRAM cell’s switching is a probabilistic phenomenon based on quantum mechanics. In order to meet this requireme... » read more

Challenges In Making And Testing STT-MRAM


Several chipmakers are ramping up a next-generation memory type called STT-MRAM, but there are still an assortment of manufacturing and test challenges for current and future devices. STT-MRAM, or spin-transfer torque MRAM, is attractive and gaining steam because it combines the attributes of several conventional memory types in a single device. In the works for years, STT-MRAM features the ... » read more

← Older posts