tag: PDF Solutions

Hidden Impacts Of Software Updates
By Ed Sperling - 10 May, 2022 - Comments: 0

Over-the-air updates can reduce obsolescence over longer chip and system lifetimes, but those updates also can impact reliability, performance, and affect how various resources such as memory and various processing elements are used. The connected world is very familiar with over-the-air (OTA) updates in smart phones and computers, where the software stack — firmware, operating systems, dr... » read more

Where And When End-to-End Analytics Works
By Anne Meixner - 10 May, 2022 - Comments: 0

With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

Novel E-Beam Techniques For Inspection And Monitoring
By PDF Solutions - 09 May, 2022 - Comments: 0

In this paper, we report an advanced e-beam defect inspection tool (eProbe®250) and the Design-for-Inspection™ (DFI) system that has been built and deployed by PDF Solutions down to 4nm FinFET technology nodes. This tool has a very high throughput which allows for in-line inspection of nanometer-level defects in the most advanced technology nodes. We also present eProbe applications for... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 06 May, 2022 - Comments: 0

Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 06 May, 2022 - Comments: 0

Automotive, mobility Stellantis is buying Share Now, a car sharing service owned by BMW and Mercedes-Benz. Through the acquisition, Stellantis will be adding 3.4 million car sharing customers, 10,000 vehicles, and 14 new European cities to its Free2move car sharing service, which currently has 2 million users, 2,500 vehicles, and has 7 “mobility hubs” in the U.S. and Europe. ShareNow was a... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 29 Apr, 2022 - Comments: 0

It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 15 Apr, 2022 - Comments: 0

Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

Finding And Applying Domain Expertise In IC Analytics
By Anne Meixner - 12 Apr, 2022 - Comments: 0

Behind PowerPoint slides depicting the data inputs and outputs of a data analytics platform belies the complexity, effort, and expertise that improve fab yield. With the tsunami of data collected for semiconductor devices, fabs need engineers with domain expertise to effectively manage the data and to correctly learn from the data. Naively analyzing a data set can lead to an uninteresting an... » read more

Fundamental Shifts In IC Manufacturing Processes
By Ed Sperling - 14 Mar, 2022 - Comments: 2

High chip value and 3D packaging are changing where and how tests are performed, tightening design-for-reliability and accelerating the shift of tools from lab to fab. Heterogeneous integration and more domain-specific designs are causing a string of disruptions for chip manufacturers, up-ending proven fab processes and methodologies, extending the time it takes to manufacture a chip, and ul... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Mar, 2022 - Comments: 0

Chipmakers and OEMs Apple has rolled out its most powerful processor, dubbed the M1 Ultra, a multi-die chip that incorporates the company's new packaging technology. The M1 Ultra is incorporated in Apple’s new Mac Studio desktop. M1 Ultra features a 20-core CPU, a 64-core GPU, and a 32-core Neural Engine. The M1 Ultra also features UltraFusion, Apple’s new packaging architecture. M1 Ult... » read more

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