tag: PDF Solutions

New Data Format Boosts Test Analytics
By Anne Meixner - 08 Sep, 2020 - Comments: 0

Demand for more and better data for test is driving a major standards effort, paving the way for one of most significant changes in data formats in years. There is good reason for this shift. Data from device testing is becoming a critical element in test program decisions regarding limits and flows. This is true for everything from automotive and medical components to complex, heterogeneous... » read more

Better Inspection, Higher Yield
By Bryon Moyer - 08 Sep, 2020 - Comments: 0

Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different machines with different capital and operating costs, and they might look like competing approaches with different economic returns. In fact, they are complementary tactics that can be balanced within an ... » read more

Far Out AI In Remote Locations
By SE Staff - 08 Sep, 2020 - Comments: 0

There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Better Analytics Needed For Assembly
By Anne Meixner - 11 Aug, 2020 - Comments: 0

Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 31 Jul, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT, 5G Qualcomm settled its 5G licensing disagreement with Huawei, which will pay $1.8 billion in back royalties and will pay for licensing going forward. Huawei is also now the world’s largest supplier of smartphones, surpassing Samsung Electronics Co. Qualcomm also announced a super-fast charging platform this week for Android devices that is sup... » read more

Next Challenge: Parts Per Quadrillion
By Ed Sperling - 29 Jul, 2020 - Comments: 0

Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Challenges For A Post-Moore’s Law World
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Monitoring IC Abnormalities Before Failures
By Anne Meixner - 07 Jul, 2020 - Comments: 0

The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how long that projected lifespan. Engineers have long used on-chip circuitry to assist with manufacturing test, silicon debug and failure analysis. Providing visibility and controllability of inter... » read more

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