Outlook: DRAM, NAND, Next-Gen Memory

By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Jim Handy, director at Objective Analysis, sat down with Semiconductor Engineering to talk about the 3D NAND, DRAM and next-generation memory markets. What follows are excerpts of that discussion. SE: How would you characterize the NAND market thus far in 2021? Handy: All chips are seeing unusual strength in 2021, but NAND flash and DRAM are doing what they usually do by exhibiting more e... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 05 Jul, 2019 - Comments: 0

Fab tools and materials Applied Materials has signed a definitive agreement to acquire Kokusai Electric for $2.2 billion in cash from investment firm KKR. With the acquisition of Kokusai’s semiconductor equipment unit, Applied expands its customer base and gains a foothold in the batch processing equipment business, where a tool can process wafers in parallel. Applied’s strength is in the ... » read more

Power/Performance Bits: Feb. 6

By Jesse Allen - 06 Feb, 2018 - Comments: 0

Recycling cathodes Nanoengineers at the University of California San Diego developed an energy-efficient recycling process that restores used cathodes from spent lithium ion batteries. The process involves harvesting the degraded cathode particles from a used battery and then boiling and heat treating them. In new batteries built with the cathodes, charge storage capacity, charging time and ba... » read more

Manufacturing Bits: Sept. 23

By Mark LaPedus - 23 Sep, 2014 - Comments: 0

The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: phase-change

Outlook: DRAM, NAND, Next-Gen Memory

Week In Review: Manufacturing, Test

Power/Performance Bits: Feb. 6

Manufacturing Bits: Sept. 23