Silicon Photonics Manufacturing Ramps Up

By Gregory Haley - 21 Mar, 2024 - Comments: 0

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed and stored. The laws of physics are immutable. Put simply, there are limits to how fast an electron can travel through copper. The... » read more

Optimization Of The Interface Between The PD And The AFE In High-Speed, High-Density Optical Receivers

By Technical Paper Link - 27 Oct, 2023 - Comments: 0

A technical paper titled “Optimizing the Photodetector/Analog Front-End Interface in Optical Communication Receivers” was published by researchers at University of Toronto. Abstract: "This article addresses the optimization of the interface between the photodetector (PD) and the analog front-end in high-speed, high-density optical communication receivers. Specifically, the article focuses... » read more

Research Bits: Jan. 3

By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Direct Chemisorption-Assisted Nanotransfer Printing with Wafer-Scale Uniformity and Controllability

By Technical Paper Link - 06 Apr, 2022 - Comments: 0

New academic paper from Nanyang Technological University, Korea Institute of Machinery & Materials, and Southwest Jiaotong University. Abstract "Nanotransfer printing techniques have attracted significant attention due to their outstanding simplicity, cost-effectiveness, and high throughput. However, conventional methods via a chemical medium hamper the efficient fabrication with large-area... » read more

MXene-GaN van der Waals metal-semiconductor junctions for high performance multiple quantum well photodetectors

By Technical Paper Link - 12 Oct, 2021 - Comments: 0

Abstract: "A MXene-GaN-MXene based multiple quantum well photodetector was prepared on patterned sapphire substrate by facile drop casting. The use of MXene electrodes improves the responsivity and reduces dark current, compared with traditional Metal-Semiconductor-Metal (MSM) photodetectors using Cr/Au electrodes. Dark current of the device using MXene-GaN van der Waals junctions is reduced b... » read more

Power/Performance Bits: April 11

By Jesse Allen - 11 Apr, 2017 - Comments: 0

High-efficiency silicon photodetector Electrical engineers at the University of California, Davis, and W&WSens Devices, Inc. built a new type of high-efficiency photodetector that could be monolithically integrated with silicon electronics. The new detector uses tapered holes in a silicon wafer to divert photons sideways, preserving the speed of thin-layer silicon and the efficiency o... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.