Challenges And Outlook of Photonic-Integrated Circuit Packaging (Hanyang Univ.)


A new technical paper titled "Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging" was published by researchers at Hanyang University. Excerpt "This review discusses the latest developments in photonic integrated chip packaging at the component, chip, and system levels. It also highlights the current issues and challenges of these technologies and provides futur... » read more

Attaching Fibers To Photonic Chips


Recently, Cadence held its fifth photonics summit, CadenceCONNECT: Photonics Contribution to High-Performance Computing. You can read my earlier posts: Photonic Integration—From Switching to Computing How to Design Photonics If You Don't Have a PhD: iPronics and Ayar Labs The third day was all about how to connect the incoming and outgoing fibers to the photonics chips. I will cov... » read more