Week In Review: Design, Low Power


M&A Intel acquired NetSpeed Systems, a network-on-a-chip and interconnect fabric IP and tool provider. Founded in 2011, the San Jose-based company recently put a focus on interconnects designed with AI applications in mind. Intel has cast the acquisition as a way to tie a number of its other technologies together. The team will join Intel's Silicon Engineering Group. Intel has been a NetSp... » read more

Physical Verification For Silicon Photonics: Don’t Panic!


Silicon photonics augments traditional electrical signals in integrated circuits (ICs) with light transmission to speed up data transfer and reduce power consumption. According to MarketsandMarkets, the overall silicon photonics market is worth approximately $774.1M in 2018, and is expected to reach $1,988.2M by 2023, at a CAGR of 20.8% between 2018 and 2023  [1]. Cloud computing is one market... » read more

Week In Review: Design, Low Power


M&A Intel will acquire fabless company eASIC. Founded in 1999, eASIC sells structured ASIC platforms that act as a midpoint between FPGAs and standard cell ASICs by combining FPGA-like logic and design flows with single via routing. Eventually, Intel sees potential in using its Embedded Multi-Die Interconnect Bridge (EMIB) technology to combine Intel FPGAs with structured ASICs in a system... » read more

Power/Performance Bits: May 29


Using bandwidth like a fish Researchers from the University of Georgia developed a method to make fuller use of wireless bandwidth, inspired by a cave-dwelling fish's jamming avoidance response. Eigenmannia fish live in complete darkness, sensing their environment and communicating through emitting an electric field. When two fish emit signals at similar frequencies they can interfere with ... » read more

The Week In Review: Design


Tools Synopsys debuted new versions of its circuit simulation and custom design products. FineSim SPICE provides 2X faster simulation and Monte Carlo analysis speed, CustomSim FastSPICE offers 2X speed-up for post-layout SRAM simulation and maintains multi-core scalability by providing additional 2X speed-up on four cores, and HSPICE delivers 1.5X speed-up for large post-layout designs, accord... » read more

Silicon’s Long Game


The era of all-silicon substrates and copper wires may be coming to an end. Progress in the future increasingly depends on more exotic combinations of materials that are developed for specific applications. But after years of predicting the death of silicon, it appears those predictions may be premature. That's not always obvious, given the growing number of chemical combinations being creat... » read more

Fan-Outs vs. TSVs


Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Power/Performance Bits: Oct. 3


Slowing down photonics Researchers at the University of Sydney developed a chip capable of optical data into sound waves, slowing data transfer enough to process the information. While speed is a major bonus with photonic systems, it's not as advantageous when processing data. By turning optical signals into acoustic, data can be briefly stored and managed inside the chip for processing, re... » read more

Integrated Photonics (Part 3)


Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

Executive Insight: Wally Rhines


Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to talk about industry consolidation, a shift in emphasis from chips to systems, and what the recent acquisition by Siemens will mean for Mentor. What follows are excerpts of that conversation. SE: A year ago it looked as if the entire industry was going to b... » read more

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