tag: photonics

Potential Route To Photonic FPCA Using NV Low-Loss Phase Change Material (Oxford)
By Technical Paper Link - 02 May, 2026 - Comments: 0

A new technical paper, "Nonvolatile photonic field-programmable coupler array," was published by researchers at University of Oxford. Abstract "Programmable photonic networks carry out universal unitary functions by independently operating on the amplitude and phase of guided light. Exploiting the reconfigurability and spatiospectral degrees of freedom of these systems, the majority of stat... » read more

Silicon Photonics Lights The Way To More Efficient Data Centers
By Katherine Derbyshire - 16 Apr, 2026 - Comments: 0

Key Takeaways Photonic interconnects potentially increase bandwidth density while significantly reducing power consumption. AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of different materials, introducing process compatibility and thermal and mechanical stress issues. Integrated electro-optical I/O modules are th... » read more

Photonic Packaging Resistant to Extreme Environments (NIST, Johns Hopkins, U. Of Maryland)
By Technical Paper Link - 11 Apr, 2026 - Comments: 0

A new technical paper, "Photonic chip packaging for extreme environments" was published by NIST, Johns Hopkins and University of Maryland. Abstract "Integrated photonic sensors have advanced significantly in the past decade for an ever-increasing range of applications, driven by the inherent scalability of integrated photonics combined with the precision of nanofabrication. Robust and rug... » read more

Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)
By Technical Paper Link - 31 Mar, 2026 - Comments: 0

A new technical paper, "3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment," by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract "The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional... » read more

Research Bits: Mar. 31
By Jesse Allen - 31 Mar, 2026 - Comments: 0

2D hard mask material Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material chromium oxychloride (CrOCl) as a hard mask, because its layered structure is resistant to plasma etching and enables it to be an effective mask at smaller thicknesses. “This 2D material is like lasagna. It’s a layer-by-layer structure,” said Zih... » read more

Research Bits: Mar. 17
By Jesse Allen - 17 Mar, 2026 - Comments: 0

Photonic ski jumps Researchers from Massachusetts Institute of Technology (MIT), MITRE, University of Arizona, and Sandia National Laboratories developed a new class of photonic devices that enable the precise broadcasting of light from a chip into free space. The chip uses an array of microscopic structures that curl upward, resembling tiny ski jumps, and allows control over how light is e... » read more

The Specialty Device Surge, Part 1: Wafer Size Transitions Are Powering The Future Of Specialty Devices And Bringing New Challenges
By Christopher Haire - 10 Mar, 2026 - Comments: 0

Specialty devices are the unsung heroes of modern life. For many in the semiconductor industry today, the spotlight is on the SiC and GaN power devices used in automotive, green energy, fast-charge consumer electronics (CE), and high-performance computing (HPC) applications (Figures 1 and 2). However, specialty devices are more than just power devices. They are a broad class of semiconductor... » read more

Ultrafast Laser Filamentation Dictates Energy Deposition in Narrow-Gap Semiconductors
By Technical Paper Link - 24 Feb, 2026 - Comments: 0

A new technical paper, "Extreme optical nonlinearities unveiled by ultrafast laser filamentation in semiconductors," was published by researchers at Abbe Center of Photonics, Laboratoire Hubert Curien et al. Abstract "Sky-high optical nonlinearities make semiconductors ideal platforms for multifunctional photonic devices. The fabrication of such complex devices could greatly benefit from ... » read more

Laser Arrays May Simplify Co-Packaged Optics
By Bryon Moyer - 19 Feb, 2026 - Comments: 0

Key Takeaways Moving photonic ICs into the same package as silicon helps improve performance, but lasers remain outside. A new monolithic laser array allows hundreds of colors, each individually software-tunable New options are being turned into products, which could help commercialize CPO. The move to co-packaged optics (CPO) holds the promise of putting photonic ICs (PICs)... » read more

Leading At Light Speed: What Makes Photonics Leadership Different
By Jan-Bart Smits - 19 Feb, 2026 - Comments: 0

By Jan-Bart Smits and David Harap Every time a transistor switches, it generates heat. Pack enough transistors together and you hit a wall: the chip melts before it computes. This thermal ceiling is why Splunk notes that "as physical and economic limitations are reached, the pace predicted by Moore's Law is slowing." Light solves this problem. Photons carry information without generating ... » read more

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