Accelerating Speed And Accuracy In Aeroacoustic Predictions

By Veena Parthan - 06 Jun, 2024 - Comments: 0

Simulating aeroacoustics is a tedious task that blends the complexities of fluid dynamics with the nuances of acoustic phenomena. This dual-domain challenge is marked by numerous technical obstacles, ranging from the wide range of scales involved to the subtler distinctions of acoustic signals amidst turbulent flows. To navigate these technical difficulties and advance our understanding of aero... » read more

Physics-Aware AI Is The Key To Next Gen IC Design

By Marc Swinnen - 03 Jun, 2024 - Comments: 0

Chip design projects are notorious for generating huge amounts of design data. The design process calls for a dozen or more electronic design automation (EDA) software tools to be run in sequence. Together, they write out hundreds of gigabytes of intermediate data on the way to creating a final layout for manufacturing. Traditionally, this has been seen as a problem. But this richness of data i... » read more

Digital Twins And AI Acceleration Are Transforming System Design

By Steve Brown - 07 Mar, 2024 - Comments: 0

We are at a global inflection point as we cope with the limitations of energy supply and the consequences of climate change. Regional conflicts are elevating risks in the traditional crude oil supply chain. Changes in rainfall patterns and disputes over water use priorities are limiting hydroelectric power generation. Moreover, extreme weather events have intensified the threat to lives and pro... » read more

Multiphysics Signoff Solvers At DAC 2022

By Marion Blanc - 09 Jun, 2022 - Comments: 0

It seems like just yesterday when engineers were trying to fit all the functionality they could onto a monolithic 2D integrated circuit to maximize computing performance. Moore’s Law was going strong and standard chips were what everybody used. The Design Automation Conference (DAC) 2022, scheduled for July 10 to 14 in San Francisco, will show just how far we’ve come from those days. We�... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: physics simulation

Accelerating Speed And Accuracy In Aeroacoustic Predictions

Physics-Aware AI Is The Key To Next Gen IC Design

Digital Twins And AI Acceleration Are Transforming System Design

Multiphysics Signoff Solvers At DAC 2022