tag: picosecond ultrasonics

Advanced Metrology for Backside Metallization Using Picosecond Laser Ultrasonics
By Onto Innovation - 12 May, 2026 - Comments: 0

Picosecond Ultrasonics (PULSE) Technology has emerged as a leading metrology solution for characterizing single-layer and multilayer metal films in advanced semiconductor manufacturing [1]. As a non-contact, non-destructive technique, PULSE Technology has become the tool-of-record across multiple device segments, including logic, radio frequency (RF), memory, microelectromechanical systems (MEM... » read more

Picosecond Ultrasonics: An Advanced Technology Utilized for Process Control of SiCr Thin Film Resistors
By Onto Innovation - 10 Feb, 2026 - Comments: 0

The bipolar-CMOS-DMOS (BCD) process is an advanced semiconductor technology integrating bipolar, CMOS, and DMOS devices onto a single chip, providing a compact, high-performance platform for the integration of analog, digital, and power circuitry. Thin-film resistors are employed to ensure precise resistance values and minimal temperature coefficients (TCR), thereby delivering enhanced accuracy... » read more

Using Picosecond Ultrasonic Technology For AI Packages: Part 2
By Cheolkyu Kim - 10 Jul, 2025 - Comments: 0

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve tremendous performance gains. However, the heterogeneous integration of advanced packages has its own set of process control obstacles that must be addressed, including new interconnect challenges invol... » read more

Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
By Cheolkyu Kim - 10 Jun, 2025 - Comments: 0

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the front-end of the process. In other words, the technologies that were once exclusively deployed in the first part of the process are being used to meet the increasingly stringent requirements of ad... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology
By Onto Innovation - 06 Apr, 2021 - Comments: 0

This paper is from China Semiconductor Technology International Conference (CSTIC). Picosecond Ultrasonics (PULSE Technology) has been widely adopted as the tool-of-record for metal film thickness metrology in semiconductor fabs around the world. It provides unique advantages, such as being a rapid, non-contact, non-destructive technology, and has capabilities for simultaneous multiple layer... » read more

Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities
By Onto Innovation - 08 Feb, 2021 - Comments: 0

Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultrasonic Technology (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-... » read more

Full Metrology Solutions For Advanced RF With Picosecond Ultrasonic Metrology
By Onto Innovation - 11 Jan, 2021 - Comments: 0

Picosecond Ultrasonics (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-contact, non-destructive technology and its capabilities for simultaneous multiple layer measurement. Measuring velocity and thickness simultaneously for transparent and semi-transparent films offers a lot of potential for not only monitoring ... » read more

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