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Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology


This paper is from China Semiconductor Technology International Conference (CSTIC). Picosecond Ultrasonics (PULSE Technology) has been widely adopted as the tool-of-record for metal film thickness metrology in semiconductor fabs around the world. It provides unique advantages, such as being a rapid, non-contact, non-destructive technology, and has capabilities for simultaneous multiple layer... » read more

Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities


Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultrasonic Technology (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-... » read more

Full Metrology Solutions For Advanced RF With Picosecond Ultrasonic Metrology


Picosecond Ultrasonics (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-contact, non-destructive technology and its capabilities for simultaneous multiple layer measurement. Measuring velocity and thickness simultaneously for transparent and semi-transparent films offers a lot of potential for not only monitoring ... » read more