tag: Plunify

Week In Review: Design, Low Power
By Jesse Allen - 07 Dec, 2018 - Comments: 0

RISC-V Western Digital announced big plans for RISC-V with a new open source RISC-V core, an open standard initiative for cache coherent memory over a network, and an open source RISC-V instruction set simulator. The SweRV Core features a 2-way superscalar design with a 32-bit, 9 stage pipeline core. It has clock speeds of up to 1.8Ghz on a 28mm CMOS process technology and will be used in vari... » read more

EDA Cloud Adoption Hits Speed Bumps
By Brian Bailey - 25 Oct, 2018 - Comments: 0

If moving semiconductor design to the Cloud was easy and beneficial, everyone would be doing it. But so far, few have done more than dip a toe. The level of difficulty associated with migrating to the Cloud varies, depending upon who you talk to. The reality is that not everyone makes it as easy as it could be, or is not willing to put the necessary effort into making it easier. There is cer... » read more

Is Cloud Computing Suitable for Chip Design?
By Brian Bailey - 27 Sep, 2018 - Comments: 2

Is semiconductor design being left behind in a cloud-dominated world? Finance, CRM, office applications and many other sectors have made the switch to a cloud-based computing environment, but the EDA industry and its users have hardly started the migration. Are EDA needs and concerns that different from everyone else? We are starting to see announcements from EDA companies, but few cheerleaders... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 Jul, 2018 - Comments: 0

Tools & IP Cadence uncorked the latest version of the Sigrity signal integrity analysis family of tools, adding a 3D design and 3D analysis environment integrated with Allegro PCB tools that allows users to import mechanical structures, such as cables and connectors, and merge them with the PCB for modeling and optimization as one structure. It also adds full Rigid-Flex PCB extraction from... » read more

The Week In Review: Design
By Jesse Allen - 22 Jun, 2018 - Comments: 0

Tools Synopsys revealed a power analysis solution for early SoC design as well as signoff-accurate power and reliability closure. PrimePower has reliability as a major focus, expanding power and reliability signoff and ECO closure capabilities from physical awareness to cell electromigration effects. Supported power types include peak power, average power, clock network power, leakage power, a... » read more

EDA In The Cloud (Part 3)
By Brian Bailey - 23 May, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

EDA In The Cloud (Part 2)
By Brian Bailey - 02 May, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

EDA In The Cloud
By Brian Bailey - 26 Apr, 2018 - Comments: 4

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

The Week In Review: Design
By Jesse Allen - 16 Mar, 2018 - Comments: 0

Tools Synopsys debuted new versions of its circuit simulation and custom design products. FineSim SPICE provides 2X faster simulation and Monte Carlo analysis speed, CustomSim FastSPICE offers 2X speed-up for post-layout SRAM simulation and maintains multi-core scalability by providing additional 2X speed-up on four cores, and HSPICE delivers 1.5X speed-up for large post-layout designs, accord... » read more

Pushing Performance Limits
By Brian Bailey - 08 Feb, 2018 - Comments: 0

Trying to squeeze the last bit of performance out of a chip sounds like a good idea, but it increases risk and cost, extends development time, reduced yield, and it may even limit the environments in which the chip can operate. And yet, given the amount of margin added at every step of the development process, it seems obvious that plenty of improvements could be made. "Every design can be o... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy