The Price Of Consolidation

By Ed Sperling - 24 Sep, 2015 - Comments: 0

Consolidation is causing far-reaching changes across the global semiconductor ecosystem due to the size of companies being bought and the dearth of startups to replenish those being acquired. Coupled with the rising cost and difficulty of shrinking features down to advanced process nodes—many argue that is the largest driver of consolidation—the market dynamics for who's buying IP, EDA t... » read more

Consolidation Creates Confusion

By Mike Gianfagna - 30 Jul, 2015 - Comments: 0

Consolidation in any industry is a sign of maturation. Diverse business models converge to the ones that really work. Supply and demand find equilibrium with a right-sized supply base. And generally, the fittest survive. The semiconductor industry is somewhere around a half-century old, so consolidation in this industry is to be expected, and we have certainly seen some consolidation of late. ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 27 Jun, 2014 - Comments: 0

As semiconductor technology becomes more challenging, expect more mergers and acquisitions in the fab tool sector. In a research report issued this week, Weston Twigg, an analyst with Pacific Crest Securities, sees several possible M&A scenarios in the future. There is no evidence that any deal is pending right now. But according to Twigg, here are some possible M&As that could happen i... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: PLX

The Price Of Consolidation

Consolidation Creates Confusion

The Week In Review: Manufacturing