Week In Review: Design, Low Power

By Jesse Allen - 18 Feb, 2022 - Comments: 0

AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

Manufacturing Bits: Dec. 7

By Mark LaPedus - 07 Dec, 2020 - Comments: 0

Cybersecurity for manufacturing The University of Texas at San Antonio (UTSA) has launched a center to address cybersecurity issues in the U.S. manufacturing sector. The center, called the Cybersecurity Manufacturing Innovation Institute (CyManII), is a $111 million public-private partnership. As part of the effort, UTSA will enter into a five-year corporative agreement with the U.S. Depart... » read more

Manufacturing Bits: April 24

By Mark LaPedus - 24 Apr, 2018 - Comments: 0

Super electron guns The Department of Energy’s SLAC National Accelerator Laboratory is developing a new type of electron gun based on superconducting technology. The new superconducting electron gun recently produced its first beam of electrons, according to SLAC. The technology is being developed for future high-energy X-ray lasers and ultra-fast electron microscopes. Electron guns a... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: PNNL

Week In Review: Design, Low Power

Manufacturing Bits: Dec. 7

Manufacturing Bits: April 24

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Knowledge Centers
Entities, people and technologies explored