Demonstrating The Feasibility Of The Foundry Model For Flexible Thin-Film Electronics 


A technical paper titled “Multi-project wafers for flexible thin-film electronics by independent foundries” was published by researchers at KU Leuven and imec. Abstract: "Flexible and large-area electronics rely on thin-film transistors (TFTs) to make displays, large-area image sensors, microprocessors, wearable healthcare patches, digital microfluidics and more. Although silicon-based co... » read more

On-chip 2D/3D Photonics Integration Solution Using Deposited Polycrystalline Silicon for Optical Interconnects Applications


A new technical paper titled "Polycrystalline silicon PhC cavities for CMOS on-chip integration" was published by researchers at Tyndall National Institute, Munster Technological University, and Université Grenoble Alpes, CEA, LETI. "In this work, we present an on-chip 2D and 3D photonics integration solution compatible with Front End of Line integration (FEOL) using deposited polycrystalli... » read more

Bigger, Brighter TVs


The flat panel display (FPD) industry is undergoing a renaissance, with suppliers rolling out a dizzying array of new, high-resolution technologies for mobile devices, computers and TVs. But despite being in the eye of the innovation storm, FPD equipment makers remain cautious—and for good reason. There are a slew of new LCD fabs being built today, mostly in China. This, in turn, is promp... » read more

Explosion At Mitsubishi Materials


A big explosion at a semiconductor plant shocked the electronics community last month. This article discusses what happened and the fallout on the semiconductor industry. The explosion occurred at the Mitsubishi Materials Yokkaichi plant in Yokkaichi, Mie Prefecture, at about 2 p.m. on Jan. 9. Five people were killed and 12 others were injured, some seriously. Mitsubishi Materials issued ... » read more