Maximizing Energy Efficiency For Automotive Chips

By William Ruby - 07 Mar, 2024 - Comments: 0

Silicon chips are central to today’s sophisticated advanced driver assistance systems, smart safety features, and immersive infotainment systems. Industry sources estimate that now there are over 1,000 integrated circuits (ICs), or chips, in an average ICE car, and twice as many in an average EV. Such a large amount of electronics translates into kilowatts of power being consumed – equiva... » read more

Lower Power Chips: What To Watch Out For

By Ann Mutschler - 08 Jul, 2021 - Comments: 0

Low-power design in advanced nodes and advanced packaging is becoming a multi-faceted, multi-disciplinary challenge, where a long list of issues need to be solved both individually and in the context of other issues. With each new leading-edge process node, and with increasingly dense packaging, the potential for problematic interactions is growing. That, in turn, can lead to poor yield, cos... » read more

Power Management And Integration Of IPs In SoCs: Part 2

By Progyna Khondkar - 14 May, 2020 - Comments: 0

Most IP are available as either soft or hard macros. But both pose immense challenges. This is especially so when integrating them into low power designs and conducting power aware (PA) verification, because the majority of IP are self-contained and pre-verified at the block level and they must be preserved in their entirety when integrated or verified in the SoC level. Part one of this two ... » read more

Power Management And Integration Of IPs In SoCs: Part 1

By Progyna Khondkar - 09 Apr, 2020 - Comments: 0

IPs – whether in the form of soft or hard macros – are the epicenter of today’s SoC designs. Integration of IP with low power designs and conducting power aware (PA) verification are always complex and cumbersome. Because most of these IPs are self-contained, pre-verified at the block level, and must be preserved in their totality when integrated or verified at the SoC level. Until UPF... » read more

Static Verification Of Low Power Designs

By Himanshu Bhatt - 26 Nov, 2019 - Comments: 0

Are there any chips designed today that don’t have limitations on their power consumption? For smartphones and tablets, increasing the time between charges is a clear product differentiator and a frequent design goal. Power consumption is also an issue for Internet-of-Things (IoT) devices, many of which are in inaccessible locations where battery replacement or recharge is difficult. Even com... » read more

Writing Reusable UPF For RTL And Gate-Level Low Power Verification

By Durgesh Prasad - 08 Aug, 2019 - Comments: 0

By Durgesh Prasad, Jitesh Bansal and Madhur Bhargava The Unified Power Format (UPF) is used to specify the power intent of a design. Once written, the UPF file is applied at every stage of the design cycle — starting with the RTL, then the gate-level, and finally during place and route. A major problem is that the UPF needs to be refined or modified at every stage to keep it compatible ... » read more

I Say ‘High’ [Performance], You Say ‘Low’ [Power]

By Vinay Patwardhan - 10 Aug, 2017 - Comments: 0

“…You say ‘why’, and I say ‘I don’t know…’” Actually, I do know. Everybody loves a high-performance product. Even just hearing that a product is high-performance sets higher expectations than if the product is simply described as “fast” or “powerful.” When it comes to SoC design, “high-performance” refers to a set of designs that run at very high clock freque... » read more

Could DVCon Be Better?

By Brian Bailey - 23 Feb, 2017 - Comments: 0

DVCon is undoubtedly the best conference in the industry if your interest is functional verification. In the past, it has also had a slant toward design. The focus is quite simply based on the standards activity going on within [getentity id="22028" e_name="Accellera"], the EDA industry's body that turns problems into solution in a short space of time. As those standards mature, they are handed... » read more

Mixed-Signal Design Powers Ahead

By Ann Mutschler - 10 Mar, 2016 - Comments: 1

Mixed-signal devices are at the heart of many advanced systems today because of the need to interact with the outside world, but designing and verifying these systems is getting harder. There are several reasons for this. First, almost all of these devices now have to be lower power than in the past, and in the analog space it's not as simple as just dialing down part of a block. Second, it ... » read more

A Tale Of Two Standards

By Ed Sperling - 18 Jul, 2013 - Comments: 0

By Ed Sperling It could well be one of the strangest developments in standards history. Two competing standards for power formats were rolled out in the middle of the last decade and aside from a few cries of foul they fell below the radar screen of most chip designers and architects for a half-dozen years. Fast forward to the present and the Common Power Format (CPF) and Unified Power Form... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?