Blog Review: March 19

By Ed Sperling - 19 Mar, 2014 - Comments: 0

ARM’s Diya Soubra has discovered an interesting term in relation to the Internet of Things: Compound Applications. Will that make the IoT more compelling? Mentor’s Colin Walls points to some less obvious reasons for choosing a processor. No. 4 on his list is particularly noteworthy. Synopsys’ Mick Posner has some thoughts about wearable computing prototypes. Check out the top pho... » read more

The Good Kind Of Regulation

By Barry Pangrle - 13 Mar, 2014 - Comments: 0

This month I’m taking a page from the Editor’s book, (actually the title for the article here came from Ed Sperling) and I decided that the above title would be fitting for this article. Last September we took a look at IBM’s presentations on their POWER8 processor from HotChips. One of the multiple new interesting aspects of this design was the use of many on-chip integrated voltage regu... » read more

Fastest Computers On The Planet

By Barry Pangrle - 05 Dec, 2013 - Comments: 0

The latest Green500 list (Excel spreadsheet here) was just released at the end of last month and heterogeneous systems now own the top of the list. The Top 10 systems all use a combination of Intel Xeon (mostly E5) processors paired with NVIDIA K20s. There are now 6 systems listed that have broken the 3,000 MFLOPS/W barrier and TSUBAME-KFC, belonging to the Tokyo Institute of Technology’s GSI... » read more

On-Chip MCUs Excel At Power Management

By Ann Mutschler - 10 Oct, 2013 - Comments: 0

By Ann Steffora Mutschler When it comes to supplying power to an SoC, there is an increasing trend to make it more intelligent—how to control it more accurately, how it is monitored and how it communicates with different aspects of the chip. Traditional power supply models with analog supplies have less of this control, so a number of engineering teams are considering the use of on-chip m... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Power8

Blog Review: March 19

The Good Kind Of Regulation

Fastest Computers On The Planet

On-Chip MCUs Excel At Power Management

Trending Articles

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

FOPLP Gains Traction in Advanced Semiconductor Packaging

HBM Options Increase As AI Demand Soars

Asia Government Funding Surges

Knowledge Centers
Entities, people and technologies explored