Printed Sensor Market Expands

By Nick Skelton - 17 Oct, 2019 - Comments: 0

The growing use of actionable information in new ways to make better decisions is driving brisk growth in printed electronics (PE) and sensors. According to BCC Research, the global market for sensors should grow from $173.4 billion in 2019 to reach $323.3 billion by 2024 – a compound annual growth rate (CAGR) of 13.3%. Where will this growth come from? Where are the immediate, and longer-... » read more

System Bits: Oct. 9

By Jeff Dorsch - 09 Oct, 2019 - Comments: 0

Bringing plasmonic color to solid materials Researchers at the University of California, Riverside, used silver nanoparticles (AgNPs) to produce plasmonic color-switchable films for solid materials. This effect was previously achieved only in liquids. Rapid and reversible tuning of plasmonic color in solid films, a challenge until now, holds great promise for a number of applications,” sa... » read more

Material Choices In Printed Temperature Sensors

By Ed Sperling - 24 Jul, 2019 - Comments: 0

Vijaya Kayastha, lead device development engineer at Brewer Science, talks about what’s needed for printed temperature sensors, what happens when there are impurities in the materials, how these sensors respond to stress, and how costs compare to traditional sensors. » read more

Power/Performance Bits: April 30

By Jesse Allen - 30 Apr, 2019 - Comments: 0

Printed supercapacitors Researchers at Drexel University and Trinity College created ink for an inkjet printer from MXene, a highly conductive two-dimensional material, which could be used to print flexible energy storage components, such as supercapacitors, in any size or shape. The material shows promise as an ink thanks to its high conductivity and ability to apply easily to surfaces usi... » read more

New Plastics Can Speed Flexible Printed Electronics Development

By Tony Flaim - 18 Apr, 2019 - Comments: 0

Substrates play a huge role when designing any type of device, including printed and flexible electronics. From its compatibility with your printing process or with the inks and materials you’re using, to its thermal properties, the choice of substrate can have a significant impact on the effectiveness and manufacturability of your product. However, substrate material capabilities tend to ... » read more

Making Chip Packaging Simpler

By Ed Sperling and Mark LaPedus - 21 Mar, 2019 - Comments: 1

Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

The Growing Promise Of Printed Electronics

By Ed Sperling - 10 Dec, 2018 - Comments: 1

Printing electronics using conductive ink rather than lithography is starting to move out of the research phase, with chipmakers now looking at how to commercialize this technology across a broad range of sensor applications. Unlike traditional semiconductors, which use tiny wires as circuits, printed electronics rely on conductive inks and often flexible films, although they can be printed ... » read more

Printed Electronics Materials

By Ed Sperling - 06 Aug, 2018 - Comments: 0

Brewer Science’s Dominic Miranda digs into printed electronics, why they’re becoming so important, what materials should be used, and how they can be targeted for specific applications in sensors and edge devices. https://youtu.be/tN2goxrDCqA » read more

The 3D Printing Revolution

By Ed Sperling - 24 May, 2018 - Comments: 1

3D printing always has been intriguing. More recently, it has become truly useful. And in the near future, it will become increasingly controversial. There are videos on YouTube documenting entire homes that are being printed in as little as 8 hours, priced as low as $4,000. So while there is a lot of buzz about AI eliminating jobs, 3D printing could add become another significant threat. ... » read more

Power/Performance Bits: Jan. 9

By Jesse Allen - 09 Jan, 2018 - Comments: 0

Eel-inspired power Researchers at the University of Michigan, the University of Fribourg, and the University of California-San Diego developed soft power cells with the potential to power implanted medical devices. Made of hydrogel and salt, the soft cells form the first potentially biocompatible artificial electric organ that generates more than 100 volts at a low current, the team says, enou... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: printed electronics