CEO Outlook: More Data, More Integration, Same Deadlines

By Ed Sperling - 24 Jun, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the future of chip design and EDA tools with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; and Babak Taheri, CEO of Silvaco. What ... » read more

Taming Concurrency

By Brian Bailey - 17 Jan, 2019 - Comments: 2

Concurrency adds complexity for which the industry lacks appropriate tools, and the problem has grown to the point where errors can creep into designs with no easy or consistent way to detect them. In the past, when chips were essentially a single pipeline, this wasn't a problem. In fact, the early pioneers of EDA created a suitable language to describe and contain the necessary concurrency ... » read more

System Bits: Aug. 29

By Ann Mutschler - 29 Aug, 2017 - Comments: 0

Could video goggles, and a tiny implant cure blindness? Incredibly, the world of medical research is on the verge of curing blindness. Similar to cochlear implants for deaf people, Stanford University scientists and engineers are developing new devices to this end, including a bionic vision system based on photovoltaic implants, which is awaiting approval for human clinical trials in Europe. A... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: programming languages

CEO Outlook: More Data, More Integration, Same Deadlines

Taming Concurrency

System Bits: Aug. 29

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