Managing Thermal-Induced Stress In Chips

By Karen Heyman - 16 Feb, 2023 - Comments: 0

At advanced nodes and in the most advanced packages, physics is no one's friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase mechanical stress. On the flip side, thinner dielectrics and tighter spaces make it more difficult to insulate and protect against that heat, and in conjunction with those smaller features and higher d... » read more

Bump Reliability is Challenged By Latent Defects

By Karen Heyman - 07 Feb, 2023 - Comments: 0

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Effects are already showing up and will likely only get worse as package densities increase beyond 1,000 bumps per chip. “You comb... » read more

Unknowns And Challenges In Advanced Packaging

By Ed Sperling - 19 Jan, 2023 - Comments: 0

Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that conversation. SE: Companies have been designing heterogeneous chips to take advantage of specific applications or use cases, but th... » read more

Heterogeneous Integration: Fertile Ground For Medical And Biotech Innovation

By Promex Industries - 18 Jan, 2023 - Comments: 0

Sensing components in medical and biotech devices often place severe restrictions on the assembly methods that can be employed, which is part of what is driving heightened demand for heterogeneous integration (HI). It is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations... » read more

Heterogeneous Assembly Datasheet

By Promex Industries - 16 Dec, 2022 - Comments: 0

Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a cost-effective way, ideally using a rapid process development cycle to minimize time to market. Combining technologies, as well as combining... » read more

Heterogeneous Integration Issues And Developments

By Ed Sperling - 14 Dec, 2022 - Comments: 0

There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks about how this will change chip design and manufacturing, and how those changes are likely to unfol... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices

By Dick Otte - 17 Nov, 2022 - Comments: 0

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Figure 1 provides a high-level overview of our approach. Nearly eve... » read more

Heterogeneous Assembly

By Promex Industries - 16 Nov, 2022 - Comments: 0

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 21 Oct, 2022 - Comments: 0

Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

SiPs: The Best Things in Small Packages

By Laura Peters - 20 Oct, 2022 - Comments: 0

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and processes. SiP is an essential packaging platform that integrates multiple functionalities onto a single substrate, which enables lower system cost, design flexibility, and superior electrical p... » read more

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Managing Thermal-Induced Stress In Chips

Bump Reliability is Challenged By Latent Defects

Unknowns And Challenges In Advanced Packaging

Heterogeneous Integration: Fertile Ground For Medical And Biotech Innovation

Heterogeneous Assembly Datasheet

Heterogeneous Integration Issues And Developments

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices

Heterogeneous Assembly

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